Les commandes expédiées à l’extérieur des États-Unis seront en attente pendant que l’entreprise évalue les impacts tarifaires.
Veuillez contacter votre vendeur pour obtenir de l’aide.
Référence fabricant
LX34050QPW
LX34050 Series 6V Gull Wing High Speed Inductive Position Sensor IC - TSSOP-14
| | |||||||||||
| | |||||||||||
| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :96 par Tube Style d'emballage :TSSOP-14 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | 2136 | ||||||||||
Microchip LX34050QPW - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Description of Change: Qualification of 8008MD as a new die attach material for selected LX34070, LX3302A, LX34050 and LX34311 device families available in 14L TSSOP (4.4mm) package.Reason for Change: To improved manufacturability by qualifying 8008MD as a new die attach material.Estimated Qualification Completion Date:December 2024Revision History: September 18, 2024: Issued initial notification.September 19, 2024: Re-issued initial PCN to correct the die attach pre-change material from 3280 to 2200D.November 08, 2024: Re-issued initial PCN to update affected parts list to add CPN LX3302AQPW-TR-C01 and remove LX34211QPW-TR, LX34211QPW-TR-VAO, LX3301AQPW and LX3301AQPW-TR catalog part numbers. Revised "Notification Subject", "Description of Change" and “Qualification Plan” title to reflect the removed parts numbers. Updated Pre and Post Change Summary table to include Lead-frame paddle size and DAP Surface Prep. Added Pre and post change comparison for the Lead-frame drawing. February 19, 2025: Re-issued initial PCN. Updated Pre and Post Change Summary table by removing the Lead-frame paddle size and DAP Surface Prep, as there no changes to these. Removed Pre and post change comparison for the Lead-frame drawing. Updated the affected parts list.
PCN Status:Initial NotificationPCN Type:Manufacturing ChangeDescription of Change:Qualification of Microchip Technology Tempe ? Fab 2 as an additional fab site for selected LX3302A and LX34050 device families available in 14L TSSOP (4.4mm) package.Reason for Change:To improve manufacturability by qualifying Microchip Technology Tempe ? Fab 2 (TGMR) as an additional fab location.Change Implementation Status:In ProgressEstimated Qualification Completion Date:September 2023 (2339)
Statut du produit:
Microchip LX34050QPW - Caractéristiques techniques
| Type: | Linear |
| Output Type: | Linear |
| Supply Voltage: | 4V to 6V |
| Operating Temp Range: | -40°C to +150°C |
| Style d'emballage : | TSSOP-14 |
| Méthode de montage : | Surface Mount |
Emballages disponibles
Qté d'emballage(s) :
96 par Tube
Style d'emballage :
TSSOP-14
Méthode de montage :
Surface Mount
