
Manufacturer Part #
CAP1206-1-AIA-TR
IC TOUCH SENSOR CAP 6CH 10DFN
Microchip CAP1206-1-AIA-TR - Product Specification
Shipping Information:
ECCN:
PCN Information:
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
PCN Status:Initial NotificationPCN Type:Manufacturing ChangeDescription of Change:Qualification of MMT as an additional assembly site for selected MCP990xx, EMC14xx and CAP12xx device families available in 10L VDFN (3x3x0.9mm) package.Reason for Change:To improve manufacturability by qualifying MMT as an additional assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:December 2022
Part Status:
Available Packaging
Package Qty:
5000 per Reel