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CAP1206-1-AIA-TR
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5000 per Reel
DFN-10
Surface Mount
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Product Category: 8-Bit Microcontrollers, Capacitive Touch SensorsNotification Subject: CCB 8326 Initial Notice: Qualification of MTAI as a new final test site and scan and pack site for CAP1206-1-AIA-TR, CAP1296-1-AIA-TR, CAP1293-1-AC3-TR, CAP1203-1-AC3-TR, CAP1208-1A4-TR, CAP1208-2-A4-TR and CAP1298-1-A4-TR catalog part numbers (CPN) available in 8L TDFN (2x3x0.75mm), 10L VDFN (3x3x0.9mm) and 16L VQFN (3x3x0.9mm) packages.Description of Change: Qualification of MTAI as a new final test site and scan and pack site for CAP1206-1-AIA-TR, CAP1296-1-AIA-TR, CAP1293-1-AC3-TR, CAP1203-1-AC3-TR, CAP1208-1A4-TR, CAP1208-2-A4-TR and CAP1298-1-A4-TR catalog part numbers (CPN) available in 8L TDFN (2x3x0.75mm), 10L VDFN (3x3x0.9mm) and 16L VQFN (3x3x0.9mm) packages.Reason for Change: To improve manufacturability and on-time delivery performance by qualifying MTAI as a new final test site and scan and pack site.Estimated Qualification Completion Date: October 2026
Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for CAP1203-1-AC3-TR, CAP1206-1-AIA-TR, CAP1293-1-AC3-TR, CAP1296-1AIA-TR, EMC1403-1-AIA-TR, EMC1403-2-AIA-TR, EMC1412-1-AC3-TR, EMC1412-A-AC3-TR, EMC1413-A-AIA-TR, EMC1414-A-AIA-TR, EMC1442-A-AC3-TR, EMC1444-A-AIA-TR, EMC1464-A-AIA-TR, MCP9903T-1E/9Q, MCP9903T-2E/9Q, MCP9903T-AE/9Q, MCP9904T1E/9Q, MCP9904T-2E/9Q, MCP9904T-AE/9Q, PAC1710-1-AIA-TR, PAC1711T-2E/9Q, PAC17201-AIA-TR, PAC1721T-2E/9Q, PAC1811T-2E/9Q, PAC1821T-2E/9Q and PAC1921-1-AIA-TR catalog part numbers (CPN) available in 8L TDFN (2x3x0.75mm) and 10L VDFN (3x3x0.9mm) package at MMT assembly site.Pre and Post Summary Changes: See attached SPCN doc. for detailsReason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material material at MMT assembly site.Estimated First Ship Date: 15 August 2026 (date code: 2633)
*** Update for PCN 115312 ***Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.Estimated First Ship Date:September 03, 2025 (date code: 2536)Revision History:July 22, 2025: Issued final notification.August 15, 2025: Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608A-MAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B MAH5O-T, ATECC508A-MAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608A-MAH4K-T, ATECC608A-MAH3P-T, ATECC608A MAH3Q-S, ATECC608A-MAH4W-T, ATECC608A-MAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508A-MAH2E-T, ATECC608A MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508A-MAH1C-S, ATECC508A-MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608A MAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B MAHSC-T, ATECC608A-MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.September 18, 2025: Re-issued the final notification to add PFAS Elimination and Die Attach Explanation file and updated the affected CPN list to remove ATMEGA8535L-8JU, AT89LP6440-20JU, X34070T-H/ST, LX34050QPW-TR, LX3302AQPW-TR-EASY, LX3302AQPW-TR-C01, LX34311T-H/ST, LX34070AT-H/ST, LX34070-H/ST, LX34050QPW, LX3302AQPW-EASY, LX34070T-H/STVAO, LX3302AQPW-TR, LX34050QPW-TR-VAO, LX3302AQPW-TR-GM, LX34311T-H/STVAO, LX34070AT-H/STVAO, LX34070-H/STVAO, LX3302AQPW and LX34050QPW-VAO.
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Description of Change:Qualification of MMT as an additional assembly site for selected MCP990xx, EMC14xx and CAP12xx device families available in 10L VDFN (3x3x0.9mm) package.Reason for Change:To improve manufacturability by qualifying MMT as an additional assembly site.
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.
