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Manufacturer Part #
APT200GN60J
APT200GN60J Series 600 V 283 A Trench Field Stop IGBT Module - ISOTOP®
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:10 per Tube Package Style:SOT-227 Mounting Method:Chassis Mount | ||||||||||
| Date Code: | 1922 | ||||||||||
Microchip APT200GN60J - Product Specification
Shipping Information:
ECCN:
PCN Information:
Description of Change:Qualification of MG15F-0140B as a new mold compound material for various products available in SOT-227, TO-264, TO-268 and TO-247 packages at TEAM assembly site.Reason for Change:To improve productivity by qualifying MG15F-0140B as a new mold compound material at TEAM assembly site.***Issued final notification. Provided estimated first ship date to be on June 29, 2024.
PCN Status:Final NotificationDescription of Change:Qualification of MG15F-35AB and MG15F-0140B as a new mold compound material for various products available in TO-264, SOT-227 and TO-247 packages at FSTS assembly site.Reason for Change:To improve productivity by qualifying MG15F-35AB and MG15F-0140B as a new mold compound.Change Implementation Status:In ProgressEstimated First Ship Date:June 29, 2024 (date code: 2426)
PCN Status:Initial NotificationDescription of Change:Qualification of MG15F-35AB and MG15F-0140B as a new mold compound material for various products available in TO-264, SOT-227 and TO-247 packages at FSTS assembly site.Reason for Change:To improve productivity by qualifying MG15F-35AB and MG15F-0140B as a new mold compound material at FSTS assembly site.
Description of Change:Qualification of MG15F-0140B as a new mold compound material for various products available in SOT-227, TO-264, TO-268 and TO-247 packages at TEAM assembly site.Reason for Change:To improve productivity by qualifying MG15F-0140B as a new mold compound material at TEAM assembly site.
Part Status:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=APT200GN60J&field4=Microchip&field18=https://p1na.futureelectronics.com/it/p/semiconductors--discretes--transistors--igbts/apt200gn60j-microchip-1082006
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=APT200GN60J&field4=Microchip&field18=https://p1na.futureelectronics.com/it/p/semiconductors--discretes--transistors--igbts/apt200gn60j-microchip-1082006
Microchip APT200GN60J - Technical Attributes
| CE Voltage-Max: | 600V |
| Collector Current @ 25C: | 283A |
| Power Dissipation-Tot: | 682W |
| Gate - Emitter Voltage: | 20V |
| Pulsed Collector Current: | 600A |
| Turn-on Delay Time: | 50ns |
| Turn-off Delay Time: | 560ns |
| Qg Gate Charge: | 1180nC |
| Leakage Current: | 600nA |
| Input Capacitance: | 14100pF |
| Thermal Resistance: | 0.22°C/W |
| Operating Temp Range: | -55°C to +175°C |
| No of Terminals: | 4 |
| Package Style: | SOT-227 |
| Mounting Method: | Chassis Mount |
Available Packaging
Package Qty:
10 per Tube
Package Style:
SOT-227
Mounting Method:
Chassis Mount