Manufacturer Part #
PIC32MX220F032B-I/SS
PIC32MX Series 32 kB Flash 8 kB RAM SMT 32-Bit Microcontroller - SSOP-28
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:47 per Tube Package Style:SSOP-28 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip PIC32MX220F032B-I/SS - Product Specification
Shipping Information:
ECCN:
PCN Information:
*** Update for PCN 115312 ***Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.Estimated First Ship Date:September 03, 2025 (date code: 2536)Revision History:July 22, 2025: Issued final notification.August 15, 2025: Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608A-MAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B MAH5O-T, ATECC508A-MAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608A-MAH4K-T, ATECC608A-MAH3P-T, ATECC608A MAH3Q-S, ATECC608A-MAH4W-T, ATECC608A-MAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508A-MAH2E-T, ATECC608A MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508A-MAH1C-S, ATECC508A-MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608A MAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B MAHSC-T, ATECC608A-MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.September 18, 2025: Re-issued the final notification to add PFAS Elimination and Die Attach Explanation file and updated the affected CPN list to remove ATMEGA8535L-8JU, AT89LP6440-20JU, X34070T-H/ST, LX34050QPW-TR, LX3302AQPW-TR-EASY, LX3302AQPW-TR-C01, LX34311T-H/ST, LX34070AT-H/ST, LX34070-H/ST, LX34050QPW, LX3302AQPW-EASY, LX34070T-H/STVAO, LX3302AQPW-TR, LX34050QPW-TR-VAO, LX3302AQPW-TR-GM, LX34311T-H/STVAO, LX34070AT-H/STVAO, LX34070-H/STVAO, LX3302AQPW and LX34050QPW-VAO.
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
*** Update for PCN 110275 ***Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as an additional bond wire material for selected dsPIC33EPxx, dsPIC33EVxx, MCP3913, MGC3030, PIC24EP12xx, PIC24EP25xx, PIC24FJ12xx, PIC24FJ64xx, PIC32MX11xx, PIC32MX12xx, PIC32MX13xx, PIC32MX15xx, PIC32MX17xx, PIC32MX21xx, PIC32MX22xx, PIC32MX23xx, PIC32MX25xx and PIC32MX27xx device families available in 28L SSOP (.209in) package at MTAI assembly site.Reason for Change: To improve manufacturability by qualifying CuPdAu as an additional bond wire material.Estimated First Ship Date: 02 June 2025 (date code: 2523)Revision History: January 16, 2025: Issued initial notification.May 9, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on June 2, 2025.
Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as an additional bond wire material for selected dsPIC33EPxx, dsPIC33EVxx, MCP3913, MGC3030, PIC24EP12xx, PIC24EP25xx, PIC24FJ12xx, PIC24FJ64xx, PIC32MX11xx, PIC32MX12xx, PIC32MX13xx, PIC32MX15xx, PIC32MX17xx, PIC32MX21xx, PIC32MX22xx, PIC32MX23xx, PIC32MX25xx and PIC32MX27xx device families available in 28L SSOP (.209in) package at MTAI assembly site.Reason for Change:To improve manufacturability by qualifying CuPdAu as an additional bond wire material.
Part Status:
Microchip PIC32MX220F032B-I/SS - Technical Attributes
| Family Name: | PIC32MX |
| Core Processor: | MIPS32 M4K |
| Program Memory Type: | Flash |
| Flash Size (Bytes): | 32kB |
| RAM Size: | 8kB |
| Speed: | 40MHz |
| No of I/O Lines: | 19 |
| InterfaceType / Connectivity: | I2C/I2S/SPI/UART/USB |
| Peripherals: | Analog Comparators/I2C/I2S/On-Chip-ADC/SPI/UART/USB/Watchdog |
| Number Of Timers: | 15 |
| Supply Voltage: | 2.3V to 3.6V |
| Operating Temperature: | -40°C to +85°C |
| On-Chip ADC: | 9-chx10-bit |
| Watchdog Timers: | 1 |
| Package Style: | SSOP-28 |
| Mounting Method: | Surface Mount |
Features & Applications
The PIC32MX220F032B-I/SS is a 32-Bit Microcontroller with 50 MHz, 8 KB RAM, 32 KB flash and available in SSOP-28 surface mount package.
Features:
- Key Features:
- 40/50 MHz, 32-bit RISC CPU with less than 0.5 mA/MHz current consumption
- Two I2S/SPI modules for Codec and serial communications
- Peripheral Pin Select (PPS) functionality
- Parallel Master Port (PMP) for graphics interfaces
- Charge Time Measurement Unit (CTMU) for mTouchTM Capacitive touch buttons and sliders
- Temperature Range - 40°C to 105°C
- Microcontroller Features:
- Operating voltage range of 2.3V to 3.6V
- Up to 32KB Flash memory (plus an additional 3 KB of Boot Flash)
- Up to 8K SRAM memory
- 1.56 DMIPS/MHz (Dhrystone 2.1) performance
- MIPS32® M4K® core with MIPS16e® mode for up to 40% smaller code size
- Pin-compatible with most Microchip 16-bit devices
- Multiple power management modes
- Configurable WDT with on-chip Low-Power RC oscillator for reliable operation
- Peripheral Features:
- Peripheral Pin Select (PPS) functionality
- Up to 4 channels of hardware DMA with automatic data size detection
- Two UART and I2C™ modules
- Separate PLLs for CPU and USB clocks
- Hardware Real-Time Clock and Calendar (RTCC)
- Five 16-bit Timers/Counters (two 16-bit pairs combine to create two 32-bit timers)
- Five Capture inputs and Five Compare/PWM outputs
- Audio Interface Features:
- Data communication: I2S, LJ, RJ, DSP modes
- Control interface: SPI and I2C™
- Master clock:
- Generation of fractional clock frequencies
- Can be synchronized with USB clock
- Can be tuned in run-time
- Analog Features:
- Up to 13-channel, 10-bit ADC
- Three Analog Comparators
- Charge Time Measurement Unit (CTMU)
- Debug Features:
- Four programming and debugging Interfaces
- IEEE Standard 1149.2 compatible (JTAG) boundary scan
Available Packaging
Package Qty:
47 per Tube
Package Style:
SSOP-28
Mounting Method:
Surface Mount