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Manufacturer Part #
MCP2200T-I/MQ
USB 2.0 TO UART PROTOCOL
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:3300 per Reel | ||||||||||
| Date Code: | |||||||||||
Microchip MCP2200T-I/MQ - Product Specification
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Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Microchip has released a new Product Documents for the MCP2200 Data Sheet of devices.Notification Status: FinalDescription of Change: The following is the list of modifications:1. Added information about the automotive qualification status of the device in the Features section2. Updated the Product Identification System section with an automotive qualified device.Impacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 09 Jun 2021NOTE: Please be advised that this is a change to the document only the product has not been changed
Part Status:
Available Packaging
Package Qty:
3300 per Reel