Manufacturer Part #
PIC16F882-I/ML
PIC16F Series 3.5 kB Flash 128 B RAM 20 MHz 8-Bit Microcontroller - QFN-28
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:61 per Tube Package Style:QFN-28 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip PIC16F882-I/ML - Product Specification
Shipping Information:
ECCN:
PCN Information:
*** Update for PCN 113339 ***Description of Change: Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change: To improve on-time delivery performance by qualifying UNIG as a new assembly site.Estimated First Ship Date: 30 June 2025 (date code: 2527)Revision History:November 22, 2023: Issued initial notification.October 31, 2024: Re-issued initial notification. Updated the qualification plan to include High Temperature Storage Life (HTSL) test. Updated the affected CPN list to remove the EOL'd CPNs. Updated the estimated qualification completion date and the timetable summary from June 2024 to October 2024.May 30, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on June 30, 2025. Updated affected CPN list based on the updated scope to remove selected 93LCxx, 93AAxx, 93C4xx, MCP6xx, 93C8xx, 93C7xx, 24C0xx, MCP1xx, 93C6xx, 24FCxx, SY88xx, PIC1xx, MIC5xx, SY58xx, SY89xx, 93C5xx, 24LCxx, 24AAxx, 34AAxx, 25LCxx, 25AAxx, SPN1xx and MICRxx device families and to add selected MIC46xx, SM802xx, SM803xx, MIC52xx, MIC53xx, MIC82xx, MIC27xx, MIC26xx, MIC84xx, MIC20xx, MIC94xx, MIC22xx, MIC23xx, MIC28xx, MIC44xx, PIC12xx, PIC16xx, PIC18xx and dsPIC33FJ32MC202 device families.September 18, 2025: Re-issued final notification to update the Qualification Report to include wire bond pull, wire bond shear and solderability test results. Updated affected CPN list to remove EOL'd CPNs.
*** Update for PCN 115312 ***Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.Estimated First Ship Date:September 03, 2025 (date code: 2536)Revision History:July 22, 2025: Issued final notification.August 15, 2025: Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608A-MAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B MAH5O-T, ATECC508A-MAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608A-MAH4K-T, ATECC608A-MAH3P-T, ATECC608A MAH3Q-S, ATECC608A-MAH4W-T, ATECC608A-MAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508A-MAH2E-T, ATECC608A MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508A-MAH1C-S, ATECC508A-MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608A MAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B MAHSC-T, ATECC608A-MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.September 18, 2025: Re-issued the final notification to add PFAS Elimination and Die Attach Explanation file and updated the affected CPN list to remove ATMEGA8535L-8JU, AT89LP6440-20JU, X34070T-H/ST, LX34050QPW-TR, LX3302AQPW-TR-EASY, LX3302AQPW-TR-C01, LX34311T-H/ST, LX34070AT-H/ST, LX34070-H/ST, LX34050QPW, LX3302AQPW-EASY, LX34070T-H/STVAO, LX3302AQPW-TR, LX34050QPW-TR-VAO, LX3302AQPW-TR-GM, LX34311T-H/STVAO, LX34070AT-H/STVAO, LX34070-H/STVAO, LX3302AQPW and LX34050QPW-VAO.
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
***UPDATE OF PCN109142***Description of Change: Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change: To improve on-time delivery performance by qualifying UNIG as a new assembly site.Estimated First Ship Date: 30 June 2025 (date code: 2527)
****FPCN109138 UPDATE****Description of Change: Qualification of CRM1064L as an additional die attach material for selected PIC18F1x, PIC18F2x, PIC18LF2x, PIC16F6x, PIC16LF6x, PIC16F7x, PIC16LF7x, PIC16F8x, PIC16LF8x andPIC16F9x device families available in 28L VQFN (6x6x1.0 mm) package at MTAI assembly site.Reason for Change: To improve productivity by qualifying CRM1064L as an additional die attach material at MTAI assembly site.
PCN Status:Initial NotificationDescription of Change:Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change:To improve on-time delivery performance by qualifying UNIG as a new assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:October 2024
**Update to FPCN109053 **Revision History:Re-issued initial notification. Updated the qualification plan to include the High Temperature Storage Life (HTSL) test.Description of Change:Qualification of CRM1064L as an additional die attach material for selected PIC18F1x, PIC18F2x, PIC18LF2x, PIC16F5x, PIC16F6x, PIC16LF6x, PIC16F7x, PIC16LF7x, PIC16F8x, PIC16LF8x and PIC16F9x device families available in 28L QFN (6x6x0.9mm) package at MTAI assembly site.Reason for Change:To improve productivity by qualifying CRM1064L as an additional die attach material at MTAI assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:January 2025
PCN Status:Initial NotificationDescription of Change:Qualification of CRM1064L as an additional die attach material for selected PIC18F1x, PIC18F2x, PIC18LF2x, PIC16F5x, PIC16F6x, PIC16LF6x, PIC16F7x, PIC16LF7x, PIC16F8x, PIC16LF8x and PIC16F9x device families available in 28L QFN (6x6x0.9mm) package at MTAI assembly site.Reason for Change:To improve productivity by qualifying CRM1064L as an additional die attach material at MTAI assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:January 2025
Microchip has released a new Document for the PIC16F88X Family Silicon Errata and Data Sheet Clarifications of devices.ERRATA - PIC16F88X Family Silicon Errata and Data Sheet ClarificationsNotification Status: FinalDescription of Change:Updated Data Sheet Revision Letter, Host/Client Terminology.Impacts to Data Sheet: NoneReason for Change: To improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 12 Apr 2024
Part Status:
Microchip PIC16F882-I/ML - Technical Attributes
| Family Name: | PIC16 |
| Core Processor: | PIC |
| Program Memory Type: | Flash |
| Flash Size (Bytes): | 3.5kB |
| RAM Size: | 128B |
| Speed: | 20MHz |
| No of I/O Lines: | 24 |
| InterfaceType / Connectivity: | I2C/SPI/USART |
| Peripherals: | Analog Comparators/I2C/On-Chip-ADC/PWM/SPI/USART/Watchdog |
| Number Of Timers: | 3 |
| Supply Voltage: | 2V to 5.5V |
| Operating Temperature: | -40°C to +85°C |
| On-Chip ADC: | 11-chx10-bit |
| Watchdog Timers: | 1 |
| Package Style: | QFN-28 |
| Mounting Method: | Surface Mount |
Features & Applications
Microchip provides solutions for the entire performance range of 8-bit, 16-bit, and 32-bit microcontrollers. The temperature range for this device is -40C to +85C. The package type for this device comes as a QFN. The package comes in a TUBE. In addition, this device contains: 28 Pin, 3.5KB Enh Flash, 128 RAM, 25 I/O, Pb Free.
PIC16F882/883/884/886/887 - This powerful yet easy-to-program (only 35 single word instructions) CMOS FLASH-based 8-bit microcontroller packs Microchip's powerful PIC® architecture into a 28 pin package.The PIC16F882 features 128 bytes of EEPROM data memory, self programming, an ICD, 2 Comparators, 11 channels of 10-bit Analog-to-Digital (A/D) converter, 1 capture/compare/PWM and 1 Enhanced capture/compare/PWM functions, a synchronous serial port that can be configured as either 3-wire Serial Peripheral Interface (SPI™) or the 2-wire Inter-Integrated Circuit (I²C™) bus and an Enhanced Universal Asynchronous Receiver Transmitter (EUSART). All of these features make it ideal for more advanced level A/D applications in automotive, industrial, appliances or consumer applications.
Features:
Special Microcontroller Features:
Precision Internal Oscillator:
- Factory calibrated to ±1%
- Software selectable frequency range of 8 MHz to 32 kHz
- Software tunable
- Two-Speed Start-Up mode
- Fail-safe clock monitoring for critical applications
- Clock mode switching during operation for low-power operation
Power-Saving Sleep mode
Power-on Reset (POR)
Selectable Brown-out Reset (BOR) voltage
Extended Watchdog Timer (WDT) with its own on-chip RC oscillator for reliable operation
In-Circuit Serial Programming™ (ICSP™) via two pins
In-Circuit Debug (ICD) via two pins
High-endurance Flash/EEPROM cell:
- 100,000 erase/write cycle enhanced Flash program memory, typical
- 1,000,000 erase/write cycle data EEPROM memory, typical
- Data EEPROM retention > 40 years
Self-reprogrammable under software control Programmable code protection
Peripheral Features:
Device Features:
- 1 input only pin
- 25 I/O
- High sink/source current 25 mA
- Interrupt-on-pin change option
Timers:
- TMR0: 8-bit timer/counter with 8-bit prescaler
- TMR1 enhanced: 16-bit timer/counter with
prescaler, External Gate Input mode and
dedicated low-power 32 kHz oscillator
- TMR2: 8-bit timer/counter with 8-bit period register, prescaler and postscaler Capture/Compare/PWM (CCP) module Enhanced Capture/Compare/PWM (ECCP) module with auto-shutdown and PWM steering Master Synchronous Serial Port (MSSP) module SPI™ mode, I2C™ mode with address mask capability
Enhanced Universal Synchronous Asynchronous
Receiver Transmitter (EUSART) module:
- Supports RS-485, RS-232 and LIN compatibility
- Auto-Baud Detect
- Auto-wake-up on Start bit
Ultra Low-Power Wake-up (ULPWU)
Analog Features:
10-bit 11 channel Analog-to-Digital (A/D)
Converter
2 Analog Comparator modules with:
- Programmable on-chip Voltage Reference (CVREF) module (% of VDD)
- Fixed 0.6 Vref
- Comparator inputs and outputs externally accessible
- SR Latch mode
Available Packaging
Package Qty:
61 per Tube
Package Style:
QFN-28
Mounting Method:
Surface Mount