Manufacturer Part #
PIC24FJ128GA010-I/PT
PIC24 Series 8 kB RAM 128 kB Flash 16-Bit Microcontroller - TQFP-100
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:119 per Tray Package Style:TQFP-100 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip PIC24FJ128GA010-I/PT - Product Specification
Shipping Information:
ECCN:
PCN Information:
*** Update for PCN 115312 ***Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.Estimated First Ship Date:September 03, 2025 (date code: 2536)Revision History:July 22, 2025: Issued final notification.August 15, 2025: Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608A-MAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B MAH5O-T, ATECC508A-MAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608A-MAH4K-T, ATECC608A-MAH3P-T, ATECC608A MAH3Q-S, ATECC608A-MAH4W-T, ATECC608A-MAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508A-MAH2E-T, ATECC608A MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508A-MAH1C-S, ATECC508A-MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608A MAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B MAHSC-T, ATECC608A-MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.September 18, 2025: Re-issued the final notification to add PFAS Elimination and Die Attach Explanation file and updated the affected CPN list to remove ATMEGA8535L-8JU, AT89LP6440-20JU, X34070T-H/ST, LX34050QPW-TR, LX3302AQPW-TR-EASY, LX3302AQPW-TR-C01, LX34311T-H/ST, LX34070AT-H/ST, LX34070-H/ST, LX34050QPW, LX3302AQPW-EASY, LX34070T-H/STVAO, LX3302AQPW-TR, LX34050QPW-TR-VAO, LX3302AQPW-TR-GM, LX34311T-H/STVAO, LX34070AT-H/STVAO, LX34070-H/STVAO, LX3302AQPW and LX34050QPW-VAO.
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
PCN Status:Final NotificationPCN Type:Manufacturing ChangeDescription of Change:Qualification of 4900F as new die-attach material and G631H as new mold compound material for selected dsPIC33FJ128xx, dsPIC33FJ256xx, dsPIC33FJ32Gxx, dsPIC33FJ64xx, MTR1202xx, PIC18F9xx, PIC24FJ128Gxx, PIC24FJ192Gxx, PIC24FJ256Gxx, PIC24FJ64Gxx, PIC24FJ96Gxx, PIC24HJ128GPxx, PIC24HJ256GPxx, and PIC24HJ64GPxx device families available in 100L TQFP (12x12x1mm) package.Reason for Change:To improve manufacturability by qualifying 4900F as new die-attach material and G631H as new mold compound material.Change Implementation Status:In ProgressEstimated First Ship Date:September 17, 2024 (date code: 2438)
Description of Change:Qualification of 4900F as new die-attach material and G631H as new mold compound material for selected dsPIC33FJ128xx, dsPIC33FJ256xx, dsPIC33FJ32Gxx, dsPIC33FJ64xx, MTR1202xx, PIC18F9xx, PIC24FJ128Gxx, PIC24FJ192Gxx, PIC24FJ256Gxx, PIC24FJ64Gxx, PIC24FJ96Gxx, PIC24HJ128GPxx, PIC24HJ256GPxx, and PIC24HJ64GPxx device families available in 100L TQFP (12x12x1mm) package.Reason for Change:To improve manufacturability by qualifying 4900F as new die-attach material and G631H as new mold compound material.
Final Notice: Qualification of 100L TQFP (12x12x1mm) with 240x240 Lead-Frame Paddle size at ASAC (UDG) assembly site. Pre Change: Assembled at MTAI assembly site.Post Change: Assembled at MTAI and ASAC assembly sites.Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Part Status:
Microchip PIC24FJ128GA010-I/PT - Technical Attributes
| Family Name: | PIC24F |
| Core Processor: | PIC |
| Program Memory Type: | Flash |
| Flash Size (Bytes): | 128kB |
| RAM Size: | 8kB |
| Speed: | 32MHz |
| No of I/O Lines: | 85 |
| InterfaceType / Connectivity: | I2C/SPI/UART |
| Peripherals: | Analog Comparators/I2C/On-Chip-ADC/PWM/SPI/UART/Watchdog |
| Number Of Timers: | 5 |
| Supply Voltage: | 2V to 3.6V |
| Operating Temperature: | -40°C to +85°C |
| On-Chip ADC: | 16-chx10-bit |
| Watchdog Timers: | 1 |
| Package Style: | TQFP-100 |
| Mounting Method: | Surface Mount |
Features & Applications
The PIC24FJ128GA010-I/PT is a part of PIC24F series 16 bit Microcontroller. It has an operating temperature ranging from -40ºC to +85ºC. It comes in TQFP-100 package.
The PIC24 16-bit Microcontroller featuring nanoWatt XLP™ for eXtreme Low Power consumption. Designed for power constrained and battery powered applications. Features unique peripherals like DSBOR, DSWDT and RTCC which run in Deep Sleep mode for industry leading low power performance.
Features:
- CPU:
- Up to 16 MIPS performance
- 16 x 16 Hardware Multiply, Single Cycle Execution
- 32-bit x 16-bit Hardware Divider
- C Compiler Optimized Instruction Set
- System:
- Internal oscillator support - 31 kHz to 8 MHz, up to 32 MHz with 4X PLL
- On-chip LDO Voltage Regulator
- JTAG Boundary Scan and Flash Memory Program Support
- Fail-Safe Clock Monitor – allows safe shutdown if clock fails
- Watchdog Timer with separate RC oscillator
- nanoWatt Power Managed Modes:
- Run, Idle and Sleep modes
- Multiple, Switchable Clock Modes for Optimum Performance and Power Management
- Analog Features:
- 10-bit ADC, 16 channels, 500 k samples per second
- Two Analog comparators
- Peripherals:
- 2 UART Modules with LIN and IrDA support, 4 Deep FIFO
- 2 SPI ™ Modules with 8 Deep FIFO
- 2 I2C™ Modules with Master and Slave Modes
- Five 16-bit Timer Modules
- Up to 5 Input Capture and 5 Output Compare / PWM
- Hardware RTCC, Real-Time Clock Calendar with Alarms
- PMP, Parallel Master Port, with 16 Address Lines, and 8/16-bit Data
Available Packaging
Package Qty:
119 per Tray
Package Style:
TQFP-100
Mounting Method:
Surface Mount