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Manufacturer Part #
AVR128DB28-I/SS
128KB, SSOP28, 85C, 24MHz, 12b ADC, Comp, Opamp, MVIO, ZCD, DAC, UART, SPI, TWI
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:47 per Tube Package Style:SSOP-28 Mounting Method:Surface Mount | ||||||||||
| Date Code: | 2038 | ||||||||||
Microchip AVR128DB28-I/SS - Product Specification
Shipping Information:
ECCN:
PCN Information:
*** Update for PCN 115312 ***Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.Estimated First Ship Date:September 03, 2025 (date code: 2536)Revision History:July 22, 2025: Issued final notification.August 15, 2025: Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608A-MAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B MAH5O-T, ATECC508A-MAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608A-MAH4K-T, ATECC608A-MAH3P-T, ATECC608A MAH3Q-S, ATECC608A-MAH4W-T, ATECC608A-MAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508A-MAH2E-T, ATECC608A MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508A-MAH1C-S, ATECC508A-MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608A MAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B MAHSC-T, ATECC608A-MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.September 18, 2025: Re-issued the final notification to add PFAS Elimination and Die Attach Explanation file and updated the affected CPN list to remove ATMEGA8535L-8JU, AT89LP6440-20JU, X34070T-H/ST, LX34050QPW-TR, LX3302AQPW-TR-EASY, LX3302AQPW-TR-C01, LX34311T-H/ST, LX34070AT-H/ST, LX34070-H/ST, LX34050QPW, LX3302AQPW-EASY, LX34070T-H/STVAO, LX3302AQPW-TR, LX34050QPW-TR-VAO, LX3302AQPW-TR-GM, LX34311T-H/STVAO, LX34070AT-H/STVAO, LX34070-H/STVAO, LX3302AQPW and LX34050QPW-VAO.
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material and 3280 as a new die attach material for selected PIC16F18xx, PIC18F24xx, PIC18F25xx, PIC18F26xx, PIC16F15xx, PIC18F27xx, AVR64DU2xx, AVR32DA2xx, AVR64DD2xx, AVR32DD2xx, AVR16DD2xx, PIC16F19xx, AVR128DBxx, AVR64DB2xx, AVR32DB2xx, AVR128DAxx, AVR64DA2xx, AVR32DU2xx and AVR16DU2xx device families available in 28L SSOP (.209in) at MTAI assembly site.Reason for Change: To improve productivity by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material and 3280 as a new die attach material.
Description of Change:• Document:o General editorial updateso Back Matter and PDF front cover updates• Added Erratum for silicon Rev. A4, Rev. A5 and Rev. B0:o ADC: ADC MUX Selection and Accumulation Number has Delayed Update When Initialization Delay is Usedo TCB: TCB4 Waveform Output Alternative 1 Non-Functional• Added Data Sheet Clarifications:o Device: FUSE - Configuration and User Fuseso CLKCTRL - Clock Controller: Interruptso RSTCTRL - Reset Controller: Domains Affected By Reseto SLPCTRL - Sleep Controller: Sleep Modeso SPI - Serial Peripheral Interface: Client Modeo SPI - Serial Peripheral Interface: Buffer Modeo UPDI - Unified Program and Debug Interface: UPDI - Reset Controllero Electrical Characteristics: USARTo Electrical Characteristics: ACo Electrical Characteristics: ADCo Electrical Characteristics: DACo Characteristics Graphs: BODReason for Change: To improve productivity.Date Document Changes Effective: 25 Apr 2025
Microchip has released a new Document for the AVR128DB28/32/48/64 Silicon Errata and Data Sheet Clarification of devices.Notification Status: FinalDescription of Change:• Document: General editorial updates• Added Errata for silicon Rev. B0:– Device: 2.2.4. Write Operation Lost if Consecutive Writes to Specific Address Spaces– NVMCTRL: 2.7.2. NVM_EEPROM_ERASE Command does Not Respect Write Protect– PORT: 2.9.1. PD0 Input Buffer is Floating– TCD: 2.14.3. Halting TCD and Waiting for SW Restart Does Not Work if Compare Value A is 0 orDual Slope Mode is Used– TWI: 2.15.2. Flush Non-Functional– USART: 2.16.3. Receiver Non-Functional after Detection of Inconsistent Synchronization Field• Added Data Sheet Clarifications:– SPI: 3.1.1. SPI - Serial Peripheral Interface– SPI: 3.1.2. SPI - Serial Peripheral Interface– Electrical Characteristics: 3.2.1. I/O Pins– Electrical Characteristics: 3.2.2. SPIImpacts to Data Sheet: NoneChange Implementation Status: CompleteDate Document Changes Effective: 01 May 2024NOTE: Please be advised that this is a change to the document only the product has not been changed.Markings to Distinguish Revised from Unrevised Devices: N/A
Microchip has released a new Errata for the Silicon Errata and Data Sheet Clarification of devices. If you are using one of these devices please read the document located at Silicon Errata and Data Sheet Clarification.Notification Status: FinalDescription of Change: Revision includes:? Document: General editorial updates? Added Errata: ? SPI: 2.11.1. Alternative 2 Pin Position is Non-Functional for SPI1 with 48-Pin Devices ? USART: 2.16.3. Receiver Non-Functional after Detection of Inconsistent Synchronization Field? Removed all data sheet clarifications as they are fixed in the current device data sheet (www.microchip.com/DS40002247)Impacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 03 January 2023NOTE: Please be advised that this is a change to the document only the product has not been changed.Markings to Distinguish Revised from Unrevised Devices::N/A
Part Status:
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Microchip AVR128DB28-I/SS - Technical Attributes
| Family Name: | AVR128 |
| Core Processor: | AVR |
| Program Memory Type: | Flash |
| Flash Size (Bytes): | 128kB |
| RAM Size: | 16kB |
| Speed: | 24MHz |
| No of I/O Lines: | 23 |
| InterfaceType / Connectivity: | I2C/SPI/UART/USART |
| Peripherals: | Brown-out Detect/POR/PWM/Reset/Watchdog |
| Supply Voltage: | 1.8V to 5.5V |
| Operating Temperature: | -40°C to +85°C |
| On-Chip ADC: | 10-chx12-bit |
| On-Chip DAC: | 1-chx10-bit |
| Package Style: | SSOP-28 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
47 per Tube
Package Style:
SSOP-28
Mounting Method:
Surface Mount