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Manufacturer Part #
MCP6N11T-001E/MNY
MCP6N11 Series 5.5 V 500 kHz Rail to Rail Instrumentation Amplifier - TDFN-8
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:3300 per Reel Package Style:TDFN-8 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip MCP6N11T-001E/MNY - Product Specification
Shipping Information:
ECCN:
PCN Information:
PCN Status:Initial NotificationDescription of Change:Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change:To improve on-time delivery performance by qualifying UNIG as a new assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:October 2024
Description of Change:Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Pre and Post Change Summary: see attachedmpacts to Data Sheet:NoneChange Impact:NoneReason for Change:To improve on-time delivery performance by qualifying UNIG as a new assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:June 2024
Revision History:December 21, 2020: Issued initial notification.April 7, 2021: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on April 15, 2021.April 13, 2021: Re-issued final notification. Corrected the lead frame lead-lock from Yes to No.Description of Change:Qualification of MMT as an additional assembly site for selected products available in 8L TDFN (2x3x0.8mm) package.Reason for Change:To improve on-time delivery performance by qualifying MMT as an additional assembly site.Estimated First Ship Date:April 15, 2021 (date code: 2116)
Description of Change:Qualification of MMT as an additional assembly site for selected products available in 8L TDFN (2x3x0.8mm) package.Reason for Change:To improve on-time delivery performance by qualifying MMT as an additional assembly site. Estimated First Ship Date:April 15, 2021 (date code: 2116)NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Revision History:December 21, 2020: Issued initial notification.January 19, 2021: Re-issued initial notification to update the pre and post change summary to correct the lead frame lead lock of NSEB from Yes to No.Description of Change: Qualification of MMT as an additional assembly site for selected products available in 8L TDFN (2x3x0.8mm) package.Pre Change:Assembled at NSEB using gold (Au) bond wire or palladium coated copper with gold flash (CuPdAu) bond wire and 8200T die attach or 8600 die attach material.Post Change:Assembled at NSEB using gold (Au) bond wire or palladium coated copper with gold flash (CuPdAu) bond wire and 8200T die attach or 8600 die attach material or assembled at MMT using palladium coated copper with gold flash (CuPdAu) bond wire and 3280 die attach material.Pre and Post Change Summary: see attachedImpacts to Data Sheet:NoneChange Impact:NoneReason for Change:To improve on-time delivery performance by qualifying MMT as an additional assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:February 2021Note: Please be advised the qualification completion times may be extended because of unforeseen business conditions however implementation will not occur until after qualification has completed and a final PCN has been issued. The final PCN will include the qualification report and estimated first ship date. Also note that after the estimated first ship date guided in the final PCN customers may receive pre and post change parts.Time Table Summary:see attached
Revised the qualification report (Future PCN 41261)Final Notice: Qualification of G700LTD molding compound and 8600 die attach epoxy for selected DFN, TDFN, UDFN and VDFN packages at NSEB site.Description of Change:Qualification of G700LTD molding compound and 8600 die attach epoxy for 6L DFN (2x2x0.9mm), 8L DFN (2x3x0.9mm), 8L DFN (4x4x0.9mm), 10L DFN (3x3x0.9mm), 8L TDFN (2x3x0.8mm), 8L UDFN (2x3x0.5mm), 10L UDFN (3x3x0.5mm), 8L VDFN (4x4x1.0mm) and 8L VDFN (5x5x1.0mm) packages at NSEB assembly site.Pre Change: G770HCD molding compound and 8200T die attach epoxyPost Change: G700LTD molding compound and 8600 die attach epoxyReason for Change: To improve manufacturability by qualifying molding compound and die attach material.
Final Notice: Qualification of G700LTD molding compound and 8600 die attach epoxy for selected DFN, TDFN, UDFN and VDFN packages at NSEB site.Description of Change:Qualification of G700LTD molding compound and 8600 die attach epoxy for 6L DFN (2x2x0.9mm), 8L DFN (2x3x0.9mm), 8L DFN (4x4x0.9mm), 10L DFN (3x3x0.9mm), 8L TDFN (2x3x0.8mm), 8L UDFN (2x3x0.5mm), 10L UDFN (3x3x0.5mm), 8L VDFN (4x4x1.0mm) and 8L VDFN (5x5x1.0mm) packages at NSEB assembly site.Pre Change: G770HCD molding compound and 8200T die attach epoxyPost Change: G700LTD molding compound and 8600 die attach epoxyReason for Change:To improve manufacturability by qualifying molding compound and die attach material.
Part Status:
Microchip MCP6N11T-001E/MNY - Technical Attributes
| No of Channels: | 1 |
| Slew Rate-Nom: | 9V/µs |
| Input Offset Voltage-Max: | 3mV |
| Package Style: | TDFN-8 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
3300 per Reel
Package Style:
TDFN-8
Mounting Method:
Surface Mount