
Manufacturer Part #
SST39SF040-70-4C-NHE
SST39SF Series 4 Mbit 512 K x 8 5 V Multi-Purpose Flash - PLCC-32
Microchip SST39SF040-70-4C-NHE - Product Specification
Shipping Information:
ECCN:
PCN Information:
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Revision History:April 25, 2022: Issued initial notification.August 08, 2022: Issued final notification. Attached the qualification report and provided an estimated ship date to be on September 10, 2022. Updated post change of Pin 1 orientation.Description of Change:Qualification of MTAI as an additional final test site for selected SST39SF040, SST39SF020A and SST39SF010A device families available in 32L PLCC (11.5x14x3.37mm) package.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying MTAI as an additional final test site.
Description of Change:Qualification of MTAI as an additional final test site for selected SST39SF040, SST39SF020A and SST39SF010A device families available in 32L PLCC (11.5x14x3.37mm) package.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying MTAI as an additional final test site.
Part Status:
Microchip SST39SF040-70-4C-NHE - Technical Attributes
Memory Density: | 4Mb |
Memory Organization: | 512 K x 8 |
Supply Voltage-Nom: | 4.5V to 5.5V |
Access Time-Max: | 70ns |
Package Style: | PLCC-32 |
Mounting Method: | Surface Mount |
Features & Applications
Available Packaging
Package Qty:
30 per Tube
Package Style:
PLCC-32
Mounting Method:
Surface Mount