BDN09-3CB/A01 in Tray by CTS | Heatsinks | Future Electronics
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CTS | BDN09-3CB/A01

Manufacturer Part #

BDN09-3CB/A01

Peel And Stick Black Anodized Heat Dissipator

ECAD Model:
Mfr. Name: CTS
Standard Pkg:
Product Variant Information section
Date Code:
Product Specification Section
CTS BDN09-3CB/A01 - Technical Attributes
Attributes Table
Thermal Resistance: 26.9°C/W
Material: Aluminum / Black Anodized
Dimension (Inch): H  0.355in x L  0.91in x W  0.91in
Features & Applications

The Series BDN Forged Heat Sinks are also known as Adhesive Peel and Stick Aluminum Heat Sinks.

Key Features:

  • Pre-applied adhesive - just peel off the release liner and press onto the component
  • Reduces assembly costs - no more messy adhesives or greases required
  • Excellent mechanical bond
  • Thermally optimized pin fin
  • Omnidirectional
  • Adhesive shear strenght at 100ºC is 36 psi. A one inch square heat sink would require 36 lb. of force to remove heat sink
  • Applicable for BGA, PGA, PLCC, and QFP packages

Notes:

  • Thermal resistance of adhesive tape is included.
  • Thermal resistance values based on power density of 3 watts/in².
  • Part numbers listed for standard black anodized heat sinks with CTS adhesive tapes
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Pricing Section
Global Stock:
0
USA:
0
On Order:
0
Factory Stock:Factory Stock:
0
Factory Lead Time:
10 Weeks
Minimum Order:
1232
Multiple Of:
56
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Tariff charges may apply if shipping to the United States. An estimate of tariff charges will be calculated at checkout.
Total
$2,365.44
USD
Quantity
Unit Price
1
$2.06
20
$2.02
40
$2.00
125
$1.96
250+
$1.92
Product Variant Information section