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Manufacturer Part #
MCP2150-I/SO
MCP2150 Series 115.2 kBaud 64 Byte Standard Protocol Stack Controller - SOIC-18
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:42 per Tube Package Style:SOIC-18 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip MCP2150-I/SO - Product Specification
Shipping Information:
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PCN Information:
Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for selected HCS370, MCP2150, MCP2155, PIC16F627, PIC16F628, PIC16F84A, PIC16F870, PIC16F871, PIC16F872, PIC16F873, PIC16F874, PIC16F876 and PIC16F877 device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated Qualification Completion Date: October 2025
Description of Change:Qualification of palladium coated copper (PdCu) bond wire and 3280 die attach epoxy in selected products of the 90K, 120K and 121K wafer technologies available in 18L SOIC package at MTAI assembly site.Pre Change: Gold wire and 8390A die attach epoxyPost Change: PdCu wire and 3280 die attach epoxyReason for Change: To improve manufacturability and qualify PdCu bond wire at MTAI assembly site.
Initial Notice: Qualification of palladium coated copper (PdCu) bond wire and 3280 die attach epoxy in selected products of the 90K, 120K and 121K wafer technologies available in 18L SOIC.Description of Change:Qualification of palladium coated copper (PdCu) bond wire and 3280 die attach epoxy in selected products of the 90K, 120K and 121K wafer technologies available in 18L SOIC package at MTAI assembly site.Pre Change: Gold wire and 8390A die attach epoxyPost Change: PdCu wire and 3280 die attach epoxyReason for Change:To improve manufacturability and qualify PdCu bond wire at MTAI assembly site.
Part Status:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=MCP2150-I/SO&field4=Microchip&field18=https://p1na.futureelectronics.com/p/7454838
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=MCP2150-I/SO&field4=Microchip&field18=https://p1na.futureelectronics.com/p/7454838
Microchip MCP2150-I/SO - Technical Attributes
| Supply Voltage-Nom: | 3V to 5.5V |
| Interface: | UART |
| Package Style: | SOIC-18 |
| Mounting Method: | Surface Mount |
Features & Applications
The MCP2150 is a cost effective, low pin count (18-pin), easy to use device for implementing IrDA standard wireless connectivity. The MCP2150 provides support for the IrDA standard protocol “stack” plus bit encoding/decoding.
The serial interface baud rates are user selectable to one of four IrDA standard baud rates between 9600 baud and 115.2 kbaud (9600, 19200, 57600, 115200). The IR baud rates are user selectable to one of five IrDA standard baud rates between 9600 baud and 115.2 kbaud (9600, 19200, 37400, 57600, 115200). The serial interface baud rate will be specified by the BAUD1:BAUD0 pins, while the IR baud rate is specified by the Primary Device (during Discover phase). This means that the baud rates do not need to be the same. The MCP2150 operates in Data Terminal Equipment (DTE) applications and sits between a UART and an infrared optical transceiver.
Features:
- Supports the IrComm (9-wire cooked service class), TinyTP, IrLMP, IrLAP layers of the IrDA
- Standard protocol stack and portions of the IrPHY layer including bit encoding/decoding
Available Packaging
Package Qty:
42 per Tube
Package Style:
SOIC-18
Mounting Method:
Surface Mount