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Manufacturer Part #
DSPIC33FJ128GP306-I/PT
dsPIC33F Series 16 kB RAM 128 kB Flash 16-Bit Digital Signal Controller -TQFP-64
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:160 per Tray Package Style:TQFP-64 Mounting Method:Surface Mount | ||||||||||
| Date Code: | 2533 | ||||||||||
Microchip DSPIC33FJ128GP306-I/PT - Product Specification
Shipping Information:
ECCN:
PCN Information:
*** Update for PCN 115312 ***Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.Estimated First Ship Date:September 03, 2025 (date code: 2536)Revision History:July 22, 2025: Issued final notification.August 15, 2025: Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608A-MAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B MAH5O-T, ATECC508A-MAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608A-MAH4K-T, ATECC608A-MAH3P-T, ATECC608A MAH3Q-S, ATECC608A-MAH4W-T, ATECC608A-MAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508A-MAH2E-T, ATECC608A MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508A-MAH1C-S, ATECC508A-MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608A MAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B MAHSC-T, ATECC608A-MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.September 18, 2025: Re-issued the final notification to add PFAS Elimination and Die Attach Explanation file and updated the affected CPN list to remove ATMEGA8535L-8JU, AT89LP6440-20JU, X34070T-H/ST, LX34050QPW-TR, LX3302AQPW-TR-EASY, LX3302AQPW-TR-C01, LX34311T-H/ST, LX34070AT-H/ST, LX34070-H/ST, LX34050QPW, LX3302AQPW-EASY, LX34070T-H/STVAO, LX3302AQPW-TR, LX34050QPW-TR-VAO, LX3302AQPW-TR-GM, LX34311T-H/STVAO, LX34070AT-H/STVAO, LX34070-H/STVAO, LX3302AQPW and LX34050QPW-VAO.
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Part Status:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=DSPIC33FJ128GP306-I/PT&field4=Microchip&field18=https://p1na.futureelectronics.com/p/8124091
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=DSPIC33FJ128GP306-I/PT&field4=Microchip&field18=https://p1na.futureelectronics.com/p/8124091
Microchip DSPIC33FJ128GP306-I/PT - Technical Attributes
| Family Name: | dsPIC33F |
| Core Processor: | dsPIC |
| Program Memory Type: | Flash |
| Flash Size (Bytes): | 128kB |
| RAM Size: | 16kB |
| Speed: | 40MHz |
| No of I/O Lines: | 53 |
| InterfaceType / Connectivity: | I2C/SPI/UART |
| Peripherals: | I2C/On-Chip-ADC/PWM/SPI/UART/Watchdog |
| Number Of Timers: | 9 |
| Supply Voltage: | 3V to 3.6V |
| Operating Temperature: | -40°C to +85°C |
| On-Chip ADC: | 18-chx10-bit / 18-chx12-bit |
| Watchdog Timers: | 1 |
| Package Style: | TQFP-64 |
| Mounting Method: | Surface Mount |
Features & Applications
Microchip provides solutions for the entire performance range of 8-bit, 16-bit, and 32-bit microcontrollers, with a powerful architecture, flexible memory technologies, comprehensive easy-to-use development tools, complete technical documentation and post design-in support through a global sales and distribution network.
16-bit PIC Microcontrollers & dsPIC Digital Signal Controllers. Microchip offers two 16-bit Microcontroller (MCU) families plus two 16-bit Digital Signal Controller (DSC) families that give you compatible options across a wide spectrum of price, performance and feature sets.
Common attributes among all 16-bit MCU and DSC families are pinouts, software, peripherals and development tools. Whether your design requires the lowest-priced 16-bit solution, the most powerful 16-bit MCU in the industry, or DSP capability, Microchip offers a broad range of products while preserving the compatibility that help save you time and money on subsequent designs.
dsPIC30F Motor Control 16-bit Digital Signal Controller. Seamless migration options from this device to dsPIC33F and PIC24 devices in similar packages.The DSPIC33FJ128GP306-I/PT 16-bit Embedded Control Solution has 128K Flashin 80-Pin TQFP package.This device is Industrial temperature (-40°C to
+85°C) and lead free.
Features:
- Operating Range.
- DC – 40 MIPS (40 MIPS @ 3.0-3.6 V).
- Industrial temperature range (-40°C to +85°C).
- High-Performance DSC CPU.
- Modified Harvard architecture.
- C compiler optimized instruction set.
- 16-bit wide data path.
- 24-bit wide instructions.
- Linear program memory addressing up to 4M instruction words.
- Linear data memory addressing up to 64 Kbytes.
- 83 base instructions: mostly 1 word/1 cycle.
- Sixteen 16-bit General Purpose Registers.
- Two 40-bit accumulators:
- With rounding and saturation options.
- Flexible and powerful addressing modes:
- Indirect, Modulo and Bit-Reversed.
- Software stack
- 16 x 16 fractional/integer multiply operations.
- 32/16 and 16/16 divide operations.
- Single-cycle multiply and accumulate:
- Accumulator write back for DSP operations.
- Dual data fetch.
- Up to ±16-bit shifts for up to 40-bit data.
Available Packaging
Package Qty:
160 per Tray
Package Style:
TQFP-64
Mounting Method:
Surface Mount
