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Manufacturer Part #
MCP6051T-E/MNY
MCP6051 Series 6 V 385 kHz Rail-to-Rail I/O Operational Amplifier-TDFN-8
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:3300 per Reel Package Style:TDFN-8 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip MCP6051T-E/MNY - Product Specification
Shipping Information:
ECCN:
PCN Information:
*** Update for PCN 110836 ***Revision History: February 11, 2025: Issued initial notification.October 30, 2025: Issued final notification.Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for multiple device families of 120k technology available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated First Ship Date: 14 November 2025 (date code: 2546)
Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for multiple device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.
****FPCN108254 UPDATE****Description of Change: Qualification of MMT as an additional assembly site for MCP6V03T-E/MNY, MCP6232T-E/MNY, MCP6V06T-E/MNY, MCP6V08T-E/MNY, MCP6V01T-E/MNY, MCP6052T-E/MNY, MCP6062T-E/MNY, MCP6402T-E/MNY, MCP6072T-E/MNY, MCP651T-E/MNY, MCP6051T-E/MNY, MCP6071T-E/MNY, MCP6061T-E/MNY, MCP661T-E/MNY, MCP6442T-E/MNY, MCP621T-E/MNY, MCP631T-E/MNY, MCP6V28T-E/MNY, MCP6V26T-E/MNY, MCP16251T-I/MNY, MCP16252T-I/MNY catalog part numbers (CPN) available in 8L TDFN (2x3x0.8mm) package.Reason for Change: To improve on-time delivery performance by qualifying MMT as an additional assembly site.
PCN Status:Initial NotificationDescription of Change:Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change:To improve on-time delivery performance by qualifying UNIG as a new assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:October 2024
Description of Change: Qualification of MMT as an additional assembly site for MCP6V03T-E/MNY, MCP6232T-E/MNY, MCP6V06T-E/MNY, MCP6V08T-E/MNY, MCP6V01T-E/MNY, MCP6052T-E/MNY, MCP6062T-E/MNY, MCP6402T-E/MNY, MCP6072T-E/MNY, MCP651T-E/MNY, MCP6051T-E/MNY, MCP6071T-E/MNY, MCP6061T-E/MNY, MCP661T-E/MNY, MCP6442T-E/MNY, MCP621T-E/MNY, MCP631T-E/MNY, MCP6V28T-E/MNY, MCP6V26T-E/MNY, MCP16251T-I/MNY, MCP16252T-I/MNY catalog part numbers (CPN) available in 8L TDFN (2x3x0.8mm) package.Reason for Change: To improve on-time delivery performance by qualifying MMT as an additional assembly site
Description of Change:Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Pre and Post Change Summary: see attachedmpacts to Data Sheet:NoneChange Impact:NoneReason for Change:To improve on-time delivery performance by qualifying UNIG as a new assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:June 2024
Revised the qualification report (Future PCN 41261)Final Notice: Qualification of G700LTD molding compound and 8600 die attach epoxy for selected DFN, TDFN, UDFN and VDFN packages at NSEB site.Description of Change:Qualification of G700LTD molding compound and 8600 die attach epoxy for 6L DFN (2x2x0.9mm), 8L DFN (2x3x0.9mm), 8L DFN (4x4x0.9mm), 10L DFN (3x3x0.9mm), 8L TDFN (2x3x0.8mm), 8L UDFN (2x3x0.5mm), 10L UDFN (3x3x0.5mm), 8L VDFN (4x4x1.0mm) and 8L VDFN (5x5x1.0mm) packages at NSEB assembly site.Pre Change: G770HCD molding compound and 8200T die attach epoxyPost Change: G700LTD molding compound and 8600 die attach epoxyReason for Change: To improve manufacturability by qualifying molding compound and die attach material.
Final Notice: Qualification of G700LTD molding compound and 8600 die attach epoxy for selected DFN, TDFN, UDFN and VDFN packages at NSEB site.Description of Change:Qualification of G700LTD molding compound and 8600 die attach epoxy for 6L DFN (2x2x0.9mm), 8L DFN (2x3x0.9mm), 8L DFN (4x4x0.9mm), 10L DFN (3x3x0.9mm), 8L TDFN (2x3x0.8mm), 8L UDFN (2x3x0.5mm), 10L UDFN (3x3x0.5mm), 8L VDFN (4x4x1.0mm) and 8L VDFN (5x5x1.0mm) packages at NSEB assembly site.Pre Change: G770HCD molding compound and 8200T die attach epoxyPost Change: G700LTD molding compound and 8600 die attach epoxyReason for Change:To improve manufacturability by qualifying molding compound and die attach material.
Part Status:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=MCP6051T-E/MNY&field4=Microchip&field18=https://p1na.futureelectronics.com/p/9010119
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=MCP6051T-E/MNY&field4=Microchip&field18=https://p1na.futureelectronics.com/p/9010119
Microchip MCP6051T-E/MNY - Technical Attributes
| No of Channels: | 1 |
| Slew Rate-Nom: | 0.15V/µs |
| Input Offset Voltage-Max: | 150µV |
| Package Style: | TDFN-8 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
3300 per Reel
Package Style:
TDFN-8
Mounting Method:
Surface Mount