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Manufacturer Part #
ATTINY261A-MU
ATtiny Series 2 kB Flash 128 B SRAM 20 MHz 8-Bit Microcontroller - QFN/MLF-32
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:490 per Tray Package Style:MLF-32 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip ATTINY261A-MU - Product Specification
Shipping Information:
ECCN:
PCN Information:
*** Update for PCN 97066/Assembly Site/Material Change***Description of Change: Qualification of MP3A as an additional assembly site for ATtiny88, ATmega328P, ATtiny861A, ATmega168PA, ATtiny461A, ATtiny261A, ATtiny48, ATmega88PA, ATmega48PA, AT90PWM81, AT90PWM81EP and AT90PWM81OS device families available in 32L VQFN (5x5x0.9mm) package using CuPdAu bond wire material.Reason for Change: To improve productivity by qualifying MP3A as an additional assembly site.Estimated First Ship Date: 19 October 2025 (date code: 2542)Revision History: March 19, 2023: Issued initial notice.March 29, 2023: Removed duplicates in NTDO-13QSSF734_Affected_CPN.September 18, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on October 19, 2025. Added CPNs AT90PWM81-16MF, AT90PWM81EP-16MN, AT90PWM81-16MN and AT90PWM81OS-B16MNR in the affected CPN list. Updated the notification subject and description of change to include AT90PWM81, AT90PWM81EP and AT90PWM81OS device families.
*** Update for PCN 115312 ***Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.Estimated First Ship Date:September 03, 2025 (date code: 2536)Revision History:July 22, 2025: Issued final notification.August 15, 2025: Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608A-MAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B MAH5O-T, ATECC508A-MAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608A-MAH4K-T, ATECC608A-MAH3P-T, ATECC608A MAH3Q-S, ATECC608A-MAH4W-T, ATECC608A-MAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508A-MAH2E-T, ATECC608A MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508A-MAH1C-S, ATECC508A-MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608A MAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B MAHSC-T, ATECC608A-MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.September 18, 2025: Re-issued the final notification to add PFAS Elimination and Die Attach Explanation file and updated the affected CPN list to remove ATMEGA8535L-8JU, AT89LP6440-20JU, X34070T-H/ST, LX34050QPW-TR, LX3302AQPW-TR-EASY, LX3302AQPW-TR-C01, LX34311T-H/ST, LX34070AT-H/ST, LX34070-H/ST, LX34050QPW, LX3302AQPW-EASY, LX34070T-H/STVAO, LX3302AQPW-TR, LX34050QPW-TR-VAO, LX3302AQPW-TR-GM, LX34311T-H/STVAO, LX34070AT-H/STVAO, LX34070-H/STVAO, LX3302AQPW and LX34050QPW-VAO.
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
***Cancellation Notification***Description of Change:This qualification was originally performed to qualify Microchip Technology Gresham Fab 4 (GRTM) as an additional fabrication site for selected Atmel products.Reason for ChangeMicrochip has decided to not qualify Microchip Technology Gresham Fab 4 (GRTM) as an additional fabrication site for selected Atmel products.
Revision History:March 14, 2023: Issued initial notification.July 12, 2023: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on July 30, 2023.Description of Change:\Qualification of MP3A as an additional assembly site for ATTINY48/88, ATTINY261A/461A/861A, ATMEGA48PA/88PA/168PA and ATMEGA328P device families available in 32LVQFN (5x5x0.9mm) package.Reason for Change:To improve productivity by qualifying MP3A as an additional assembly site.
PCN Status:Initial NotificationDescription of Change:Qualification of MP3A as an additional assembly site for ATMEGA48PA/88PA/168PA, ATTINY261A/461A/861A, ATTINY48/88 and ATMEGA328P device families available in 32L VQFN (5x5x0.9mm) package using CuPdAu bond wire material.Reason for Change:To improve productivity by qualifying MP3A as an additional assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:June 2023
PCN Status:Initial NotificationDescription of Change:Qualification of MP3A as an additional assembly site for ATMEGA48PA/88PA/168PA, ATTINY261A/461A/861A, ATTINY48/88 and ATMEGA328P device families available in 32L VQFN (5x5x0.9mm) package using CuPdAu bond wire material.Reason for Change:To improve productivity by qualifying MP3A as an additional assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:June 2023
PCN Status:Initial NotificationDescription of Change:Qualification of MP3A as an additional assembly site for ATTINY48/88, ATTINY261A/461A/861A, ATMEGA48PA/88PA/168PA and ATMEGA328P device families available in 32L VQFN (5x5x0.9mm) package.Reason for Change:To improve productivity by qualifying MP3A as an additional assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:June 2023
Part Status:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=ATTINY261A-MU&field4=Microchip&field18=https://p1na.futureelectronics.com/p/9039346
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=ATTINY261A-MU&field4=Microchip&field18=https://p1na.futureelectronics.com/p/9039346
Microchip ATTINY261A-MU - Technical Attributes
| Family Name: | ATtiny |
| Core Processor: | AVR |
| Program Memory Type: | Flash |
| Flash Size (Bytes): | 2kB |
| RAM Size: | 128B |
| Speed: | 20MHz |
| No of I/O Lines: | 16 |
| InterfaceType / Connectivity: | USI |
| Peripherals: | Brown-out Detect/POR/PWM/Reset/Temp Sensor/Watchdog |
| Number Of Timers: | 2 |
| Supply Voltage: | 1.8V to 5.5V |
| Operating Temperature: | -40°C to +85°C |
| On-Chip ADC: | 11-chx10-bit |
| Watchdog Timers: | 1 |
| Package Style: | MLF-32 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
490 per Tray
Package Style:
MLF-32
Mounting Method:
Surface Mount