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Manufacturer Part #
MCP6L01T-E/OT
MCP6L01 Series 6 V 1 MHz Rail-to-Rail I/O Operational Amplifier - SOT-23-5
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:3000 per Reel Package Style:SOT-23-5 (SOT-25) Mounting Method:Surface Mount | ||||||||||
| Date Code: | 2519 | ||||||||||
Microchip MCP6L01T-E/OT - Product Specification
Shipping Information:
ECCN:
PCN Information:
Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) bond wire as new wire material for selected MCP111T, MCP60xx, MCP62xxx, MCP6401xx, MCP654xxx, MCP656xxx, MCP6G01xx, MCP6Lxxxx, TC1270ALxxx, TC1270AMxxx, TC1270ANxxx, TC1270ARxxx, TC1270ASxxx, TC1270ATxxx and TC1271Axxxx device families available in in 5L SOT-23 package at MTAI assembly site.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) bond wire as a new wire material.Estimated First Ship Date: 08 July 2025 (date code: 2528)
Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for multiple device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected MCP11xxx, MCP60xxx, MCP61xxx, MCP62xxx, MCP64xxx, MCP65xxx, MCP6Gxxx, MCP6Lxxx, and TC127xxx device families available in 6L and 5L SOT-23 package assembled at MMT assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.
PCN Status:Initial NotificationDescription of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected MCP11xxx, MCP60xxx, MCP61xxx, MCP62xxx, MCP64xxx, MCP65xxx, MCP6Gxxx, MCP6Lxxx, and TC127xxx device families available in 6L and 5L SOT-23 package assembled at MMT assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.
Part Status:
Microchip MCP6L01T-E/OT - Technical Attributes
| Amplifier Type: | General Purpose |
| No of Channels: | 1 |
| Slew Rate-Nom: | 0.6V/µs |
| Input Offset Voltage-Max: | 5mV |
| Gain Bandwidth Product: | 1MHz |
| Average Bias Current-Max: | 2pA |
| Supply Voltage: | 1.8V to 6V |
| Common Mode Rejection Ratio: | 78dB |
| Supply Current: | 85µA |
| Output Type: | Rail to Rail |
| Power Supply Rejection Ratio: | 83dB |
| Operating Temp Range: | -40°C to +125°C |
| DC Voltage Gain: | 105dB |
| Phase Margin: | 90° |
| Low Noise: | 24nV/√Hz |
| Output Current: | 20mA |
| Package Style: | SOT-23-5 (SOT-25) |
| Mounting Method: | Surface Mount |
Features & Applications
Available Packaging
Package Qty:
3000 per Reel
Package Style:
SOT-23-5 (SOT-25)
Mounting Method:
Surface Mount