
Manufacturer Part #
MCP3021A5T-E/OT
Single Channel I2C Interface 5.5 V 22.3 kbps 10-Bit A/D Converter - SOT-23-5
Microchip MCP3021A5T-E/OT - Product Specification
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Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new wire material for selected MCP18x, MCP60x, MCP61x, MCP6Lx, MCP13x, MCP32x, MCP30x, TC74, MCP65x, MCP64x, MCP62x, MCP6Gx, TC118x, TC101x, TC107x, TC105x, TC122x, TC201x, TC218x, and TC205x device families available in 5L SOT-23 package at MTAI assembly site.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.
Description of Change:Revision DFollowing is the list of changes for this revision:? Added AEC-Q100 Qualification to Features and General Description.? Added Related Devices.? Updated the temperature range from industrial (-40?C to +85?C) to extended (-40?C to +125?C), "Electrical Specifications"? Updated Product Identification System.? Added Product Identification System (Automotive).? Changed terminology:- Master device ? Host device- Slave device ? Client device? Several minor improvements to text formatting, parameter symbols and figures.? Updated Trademark, Legal Notice and Microchip Devices Code Protection Feature information. For details, refer to the Microchip Information page.? Removed Worldwide Sales and Service page.Reason for Change: To improve productivity
Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for multiple device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected MCP13xx, MCP1824, MCP3021Axx, MCP3221Axx, MCP6xx, TC10xx,TC118xx, TC122xx, TC20xx, TC218xx and TC74Axx device families available in 6L and 5L SOT-23 packages assembled at MMT assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected MCP13xx, MCP1824, MCP3021Axx, MCP3221Axx, MCP6xx, TC10xx, TC118xx, TC122xx, TC20xx, TC218xx and TC74Axx device families available in 6L and 5L SOT-23 packages assembled at MMT assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.
Part Status:
Microchip MCP3021A5T-E/OT - Technical Attributes
Interface: | I2C |
No of Channels: | 1 |
Resolution: | 10b |
Supply Voltage: | 2.7V to 5.5V |
Sampling Rate: | 22.3kbps |
Operating Temp Range: | -40°C to +125°C |
Storage Temperature Range: | -65°C to +150°C |
Package Style: | SOT-23-5 (SOT-25) |
Mounting Method: | Surface Mount |
Features & Applications
Available Packaging
Package Qty:
3000 per Reel
Package Style:
SOT-23-5 (SOT-25)
Mounting Method:
Surface Mount