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Amphenol Communications Solutions | DILB20P-223TLF

Manufacturer Part #

DILB20P-223TLF

20 Position (2 x 10 ) 2.54 mm Pitch Open Frame Through Hole DIP Socket

ECAD Model:
Mfr. Name: Amphenol Communications Solutions
Standard Pkg:
Product Variant Information section
Date Code:
Product Specification Section
Amphenol Communications Solutions DILB20P-223TLF - Technical Attributes
Attributes Table
Type: DIP Socket
Style: PCB Through Hole
No of Pins: 20
Termination Style/Mounting: Solder
Terminal Pitch: 2.54mm
Contact Material: Copper Alloy
Contact Plating: Tin
Rated Current: 1A
Material: Polyamide
Insulation Resistance: 1000MΩ
Operating Temp Range: -55°C to +105°C
No of Rows: 2
Dielectric Withstanding Voltage: 1000V
Mounting Method: Through Hole
Pricing Section
Global Stock:
0
USA:
0
On Order:
0
Factory Stock:Factory Stock:
0
Factory Lead Time:
10 Weeks
Minimum Order:
14400
Multiple Of:
7200
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Tariff charges may apply if shipping to the United States. An estimate of tariff charges will be calculated at checkout.
Total
$4,608.00
USD
Quantity
Unit Price
1
$0.355
75
$0.35
250
$0.34
750
$0.335
2,500+
$0.32
Product Variant Information section