
Manufacturer Part #
SST39VF010-70-4C-NHE
SST39VF Series 1 Mbit 128 K x 8 3 V Multi-Purpose Flash - PLCC-32
Microchip SST39VF010-70-4C-NHE - Product Specification
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Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Description of Change:Microchip has released a new Datasheet for the SST39LF010/SST39LF020/SST39LF040/SST39VF010/SST39VF020/SST39VF040 - 1-Mbit/2-Mbit/4-Mbit (x8) Multi-Purpose Flash of devices. Updated TSOP package marking; Minor editorial updates throughout the document.Reason for Change: To Improve ProductivityDate Document Changes Effective: 12 Jun 2025
Revision History:August 8, 2022: Issued initial notification.November 18, 2022: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on December 9, 2022.Description of Change:Qualification of MTAI as a new final test site for selected SST39LF0xx and SST39VF0xx device families available in 32L PLCC (11.5x14x3.37mm) package.Reason for Change:To improve productivity by qualifying MTAI as a new final test site.
Part Status:
Microchip SST39VF010-70-4C-NHE - Technical Attributes
Memory Density: | 1Mb |
Memory Organization: | 128 K x 8 |
Supply Voltage-Nom: | 2.7V to 3.6V |
Access Time-Max: | 70ns |
Package Style: | PLCC-32 |
Mounting Method: | Surface Mount |
Features & Applications
Available Packaging
Package Qty:
30 per Tube
Package Style:
PLCC-32
Mounting Method:
Surface Mount