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Manufacturer Part #
SST49LF080A-33-4C-NHE
SST49LF Series 8 Mbit 1024 K x 8 3.3 V Low Pin Count Serial Flash - PLCC-32
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:30 per Tube Package Style:PLCC-32 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip SST49LF080A-33-4C-NHE - Product Specification
Shipping Information:
ECCN:
PCN Information:
*** Update for PCN 115312 ***Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.Estimated First Ship Date:September 03, 2025 (date code: 2536)Revision History:July 22, 2025: Issued final notification.August 15, 2025: Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608A-MAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B MAH5O-T, ATECC508A-MAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608A-MAH4K-T, ATECC608A-MAH3P-T, ATECC608A MAH3Q-S, ATECC608A-MAH4W-T, ATECC608A-MAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508A-MAH2E-T, ATECC608A MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508A-MAH1C-S, ATECC508A-MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608A MAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B MAHSC-T, ATECC608A-MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.September 18, 2025: Re-issued the final notification to add PFAS Elimination and Die Attach Explanation file and updated the affected CPN list to remove ATMEGA8535L-8JU, AT89LP6440-20JU, X34070T-H/ST, LX34050QPW-TR, LX3302AQPW-TR-EASY, LX3302AQPW-TR-C01, LX34311T-H/ST, LX34070AT-H/ST, LX34070-H/ST, LX34050QPW, LX3302AQPW-EASY, LX34070T-H/STVAO, LX3302AQPW-TR, LX34050QPW-TR-VAO, LX3302AQPW-TR-GM, LX34311T-H/STVAO, LX34070AT-H/STVAO, LX34070-H/STVAO, LX3302AQPW and LX34050QPW-VAO.
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
PCN Status:Final NotificationRevision History:August 26, 2022: Issued initial notification.December 6, 2022: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on December 22, 2022.PCN Type:Manufacturing ChangeMicrochip Parts Affected:Please open one of the files found in the Affected CPNs section.Note: For your convenience Microchip includes identical files in two formats (.pdf and .xls)Description of Change:Qualification of MTAI as a new final test site for selected SST49LF008A and SST49LF080A device families available in 32L TSOP (8x14mm) and 32L PLCC (11.5x14x3.37mm) packages.Pre and Post Change Summary: see attachedImpacts to Data Sheet:NoneChange ImpactNoneReason for Change:To improve manufacturability by qualifying MTAI as new final test site.Change Implementation Status:In ProgressEstimated First Ship Date:December 21, 2022 (date code: 2252)Note: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Time Table Summary: see attached
PCN Status:Initial NotificationPCN Type:Manufacturing ChangeMicrochip Parts Affected:Please open one of the files found in the Affected CPNs section.Note: For your convenience Microchip includes identical files in two formats (.pdf and .xls)Description of Change:Qualification of MTAI as a new final test site for selected SST49LF008A and SST49LF080A device families available in 32L TSOP (8x14mm) and 32L PLCC (11.5x14x3.37mm) packages.Pre and Post Change Summary: See attached For 32L TSOP (8x14mm) package:For 32L PLCC (11.5x14x3.37mm) package:Impacts to Data Sheet:NoneChange ImpactNoneReason for Change:To improve manufacturability by qualifying MTAI as new final test site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:September 2022Note: Please be advised the qualification completion times may be extended because of unforeseen business conditions however implementation will not occur until after qualification has completed and a final PCN has been issued. The final PCN will include the qualification report and estimated first ship date. Also note that after the estimated first ship date guided in the final PCN customers may receive pre and post change parts.Time Table Summary: See attached
Part Status:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=SST49LF080A-33-4C-NHE&field4=Microchip&field18=https://p1na.futureelectronics.com/p/memory--flash--serial/sst49lf080a-33-4c-nhe-microchip-9431438
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=SST49LF080A-33-4C-NHE&field4=Microchip&field18=https://p1na.futureelectronics.com/p/memory--flash--serial/sst49lf080a-33-4c-nhe-microchip-9431438
Microchip SST49LF080A-33-4C-NHE - Technical Attributes
| Clock Frequency-Max: | 33MHz |
| Memory Density: | 8Mb |
| Memory Organization: | 1 M x 8 |
| Supply Voltage-Nom: | 3V to 3.6V |
| Temperature Grade: | Commercial |
| Package Style: | PLCC-32 |
| Mounting Method: | Surface Mount |
Features & Applications
NOTE: This SST product is migrating to the preferred Microchip (MCP) part number. All products bearing the Microchip part number are identical in form, fit and function to the products with the legacy SST prefix/logo mark.
The SST49LF080A-33-4C-NHE is a part of SST49LF Series Flash Memory. It has an standard operating temperature ranging from 0°C to +85°C, it comes in TSOP-32 package.
The SST49LF080A flash memory device is designed to interface with the LPC bus for PC and Internet Appliance application in compliance with Intel Low Pin Count (LPC) Interface Specification 1.0. Two interface modes are supported: LPC mode for in-system operations and Parallel Programming (PP) mode to interface with programming equipment.
Features:
- LPC Interface Flash
- SST49LF080A: 1024K x8 (8 Mbit)
- Conforms to Intel LPC Interface Specification 1.0
- Flexible Erase Capability
- Uniform 4 KByte Sectors
- Uniform 64 KByte overlay blocks
- 64 KByte Top Boot Block protection
- Chip-Erase for PP Mode Only
- Single 3.0-3.6 V Read and Write Operations
- Superior Reliability
- Endurance: 100,000 Cycles (typical)
- Greater than 100 years Data Retention
- Low Power Consumption
- Active Read Current: 6 mA (typical)
- Standby Current: 10 μA (typical)
- Two Operational Modes
- Low Pin Count (LPC) Interface mode for in-system operation
- Parallel Programming (PP) Mode for fast production programming
- Parallel Programming (PP) Mode
- 11-pin multiplexed address and 8-pin data I/O interface
- Supports fast programming In-System on programmer equipment
- CMOS and PCI I/O Compatibility
- All non-Pb (lead-free) devices are RoHS compliant
Available Packaging
Package Qty:
30 per Tube
Package Style:
PLCC-32
Mounting Method:
Surface Mount