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Manufacturer Part #
MIC2005A-2YM6-TR
MIC2005 Series 1 Channel 5.5V 500mA High Side Power Distribution Switch SOT-23-6
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:3000 per Reel Package Style:SOT-23-6 (SOT-26) Mounting Method:Surface Mount | ||||||||||
| Date Code: | 2402 | ||||||||||
Microchip MIC2005A-2YM6-TR - Product Specification
Shipping Information:
ECCN:
PCN Information:
Description of Change:Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for selected MIC18xx, MIC20xx, MIC23xx, MIC27xx, MIC28xx, MIC33xx, MIC47xx, MIC51xx, MIC53xx, MIC63xx, MIC80xx, MIC81xx, MIC82xx and MIC94xx device families available in various packages.Reason for Change:To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Change Implementation Status:In ProgressEstimated Qualification Completion Date:September 2025
Revision History:May 06, 2022: Issued initial notification.January 23, 2023: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on February 28, 2023.Description of Change:Qualification of G700 as a new mold compound material for selected MIC20xxx and MIC5159 device families available in 6L SOT-23 package assembled at STAR assembly site.Reason for Change:To improve manufacturability by qualifying G700 as a new mold compound material.
Description of Change:Qualification of G700 as a new mold compound material for selected MIC20xxx and MIC5159 device families available in 6L SOT-23 package assembled at STAR assembly site.Pre and Post Change Summary: See attachedmpacts to Data Sheet: NoneChange ImpactNoneReason for Change:To improve manufacturability by qualifying G700 as a new mold compound materialChange Implementation Status:In ProgressEstimated Qualification Completion Date:July 2022Note: Please be advised the qualification completion times may be extended because of unforeseen business conditions however implementation will not occur until after qualification has completed and a final PCN has been issued. The final PCN will include the qualification report and estimated first ship date. Also note that after the estimated first ship date guided in the final PCN customers may receive pre and post change parts.Time Table Summary: See attached
Part Status:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=MIC2005A-2YM6-TR&field4=Microchip&field18=https://p1na.futureelectronics.com/p/semiconductors--analog--power-switches/mic2005a-2ym6-tr-microchip-2008592
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=MIC2005A-2YM6-TR&field4=Microchip&field18=https://p1na.futureelectronics.com/p/semiconductors--analog--power-switches/mic2005a-2ym6-tr-microchip-2008592
Microchip MIC2005A-2YM6-TR - Technical Attributes
| Configuration: | High Side |
| Input Voltage: | 2.5V to 5.5V |
| No of Elements: | Single |
| On-state Resistance-Max: | 220mΩ |
| Rated Current-Max: | 500mA |
| Type: | Power Distribution Switch |
| Package Style: | SOT-23-6 (SOT-26) |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
3000 per Reel
Package Style:
SOT-23-6 (SOT-26)
Mounting Method:
Surface Mount