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Manufacturer Part #
MIC2133YML-TR
MIC2133 Series 75 V 1 MHz Surface Mount Buck Switching Controller - VQFN-32
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:3300 per Package Style:VQFN-32 Mounting Method:Surface Mount | ||||||||||
| Date Code: | 2130 | ||||||||||
Microchip MIC2133YML-TR - Product Specification
Shipping Information:
ECCN:
PCN Information:
*** Update for PCN 113339 ***Description of Change: Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change: To improve on-time delivery performance by qualifying UNIG as a new assembly site.Estimated First Ship Date: 30 June 2025 (date code: 2527)Revision History:November 22, 2023: Issued initial notification.October 31, 2024: Re-issued initial notification. Updated the qualification plan to include High Temperature Storage Life (HTSL) test. Updated the affected CPN list to remove the EOL'd CPNs. Updated the estimated qualification completion date and the timetable summary from June 2024 to October 2024.May 30, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on June 30, 2025. Updated affected CPN list based on the updated scope to remove selected 93LCxx, 93AAxx, 93C4xx, MCP6xx, 93C8xx, 93C7xx, 24C0xx, MCP1xx, 93C6xx, 24FCxx, SY88xx, PIC1xx, MIC5xx, SY58xx, SY89xx, 93C5xx, 24LCxx, 24AAxx, 34AAxx, 25LCxx, 25AAxx, SPN1xx and MICRxx device families and to add selected MIC46xx, SM802xx, SM803xx, MIC52xx, MIC53xx, MIC82xx, MIC27xx, MIC26xx, MIC84xx, MIC20xx, MIC94xx, MIC22xx, MIC23xx, MIC28xx, MIC44xx, PIC12xx, PIC16xx, PIC18xx and dsPIC33FJ32MC202 device families.September 18, 2025: Re-issued final notification to update the Qualification Report to include wire bond pull, wire bond shear and solderability test results. Updated affected CPN list to remove EOL'd CPNs.
***UPDATE OF PCN109142***Description of Change: Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change: To improve on-time delivery performance by qualifying UNIG as a new assembly site.Estimated First Ship Date: 30 June 2025 (date code: 2527)
Description of Change: Qualification of Microchip Technology Tempe ? Fab 2 (TMGR) as an additional fabrication site for selected MIC2129, MIC2133 and MIC2132 device families available in various packages.Reason for Change: To improve on-time delivery performance by qualifying Microchip Technology Tempe ? Fab 2 (TMGR) as an additonal fabrication site.December 12, 2024: Re-issued final notification to revise the pre and post change table to include pre change fab site GRTM under post change. Updated the notification subject from "new fabrication site" to "additional fabrication site."
PCN Status:Initial NotificationDescription of Change:Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change:To improve on-time delivery performance by qualifying UNIG as a new assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:October 2024
Description of Change:Qualification of Microchip Technology Tempe ? Fab 2 (TMGR) as a new fabrication site for selected MIC2129, MIC2133 and MIC2132 device families available in various packages.Reason for Change:To improve on-time delivery performance by qualifying Microchip TechnologyTempe ? Fab 2 (TMGR) as a new fabrication site.
Description of Change:Qualification of Microchip Technology Tempe ? Fab 2 (TMGR) as a new fabrication site for selected MIC2129, MIC2133 and MIC2132 device families available in various packages.Reason for Change:To improve on-time delivery performance by qualifying Microchip Technology Tempe ? Fab 2 (TMGR) as a new fabrication site
Description of Change:Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Pre and Post Change Summary: see attachedmpacts to Data Sheet:NoneChange Impact:NoneReason for Change:To improve on-time delivery performance by qualifying UNIG as a new assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:June 2024
Part Status:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=MIC2133YML-TR&field4=Microchip&field18=https://p1na.futureelectronics.com/p/semiconductors--analog--regulators-reference--switching-regulators/mic2133yml-tr-microchip-4166954
Microchip MIC2133YML-TR - Technical Attributes
| Topology: | Buck |
| Input Voltage: | 4.5V to 75V |
| Output Voltage Range: | 0.6V to 28V |
| Output Type: | Adjustable |
| Switching Frequency-Max: | 1MHz |
| Operating Temp Range: | -40°C to +125°C |
| Duty Cycle-Max: | 85% |
| No. of Outputs: | 1 |
| Quiescent Current: | 8000µA |
| Storage Temperature Range: | -65°C to +150°C |
| Package Style: | VQFN-32 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
3300 per
Package Style:
VQFN-32
Mounting Method:
Surface Mount