Manufacturer Part #
MIC23150-CYMT-TR
MIC23150 Series 4 MHz 2 A PWM Buck Regulator with HyperLight Load™ - TMLF-8
| | |||||||||||
| | |||||||||||
| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:5000 per Std. Mfr. Pkg Package Style:TMLF-8 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip MIC23150-CYMT-TR - Product Specification
Shipping Information:
ECCN:
PCN Information:
***UPDATE OF PCN102012 & PCN111465***Description of Change: Qualification of UNIG as new assembly site for selected MIC2111xx, MIC2225, MIC2285A, MIC23150, MIC232xx, MIC2800, MIC28xx and MIC2821 device families available in various packages.Reason for Change: To improve manufacturability by qualifying UNIG as a new assembly site.Estimated First Ship Date: 16 April 2025 (date code: 2516)
*****FPCN111595 UPDATE/LOCATION CHANGE*****Description of Change:August 18, 2025: Issued final notification. Attached the Qualification Report. Provided the estimatedfirst ship date to be on October 29, 2025Fabrication Site:OLD- Microchip Technology Tempe ? Fab 2(TMGR)NEW- Microchip Technology Colorado (MCSO)Wafer SizeOLD- 8"NEW- 6"
Description of Change:Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for selected MIC18xx, MIC20xx, MIC23xx, MIC27xx, MIC28xx, MIC33xx, MIC47xx, MIC51xx, MIC53xx, MIC63xx, MIC80xx, MIC81xx, MIC82xx and MIC94xx device families available in various packages.Reason for Change:To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Change Implementation Status:In ProgressEstimated Qualification Completion Date:September 2025
Description of Change: Qualification of UNIG as new assembly site for selected MIC2111xx, MIC2225, MIC2285A, MIC23150, MIC232xx, MIC2800, MIC28xx and MIC2821 device families available in various packages.Reason for Change: To improve manufacturability by qualifying UNIG as a new assembly site.Estimated First Ship Date: 16 April 2025 (date code: 2516)Revision History: November 23, 2023: Issued initial notification.March 07, 2025: Issued final notification. Attached Qualification Report. Revised affected parts list to remove MIC2111BYMT-T5 and MIC2111CYMT-T5 catalog part numbers due to EOL. Provided Estimated First Ship Date on April 16, 2025.
Revision History:May 29, 2023: Issued initial notification.May 24, 2024: Issued final notification. Attached the Qualification Report. Revised the affected parts list due to updated scope. Provided estimated first ship date to be on June 14, 2024.Description of Change:Qualification of UNIG as a new final test site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying UNIG as a new final test site.
Description of Change:Qualification of UNIG as new assembly site for selected MIC2111xx, MIC2225, MIC2285A, MIC23150, MIC232xx, MIC2800, MIC28xx and MIC2821 device families available in various packages.Reason for Change:To improve manufacturability by qualifying UNIG as a new assembly sitePre and Post Change Summary: See attached
Part Status:
Microchip MIC23150-CYMT-TR - Technical Attributes
| Topology: | Buck |
| Input Voltage: | 2.7V to 5.5V |
| Output Current-Max: | 2A |
| Output Type: | Fixed |
| Switching Frequency-Max: | 4MHz |
| Operating Temp Range: | -40°C to +125°C |
| Duty Cycle-Max: | 80% |
| Efficiency: | 93% |
| No. of Outputs: | 1 |
| Quiescent Current: | 40µA |
| Storage Temperature Range: | -65°C to +150°C |
| Load Regulation (%): | 0.75% |
| Package Style: | TMLF-8 |
| Mounting Method: | Surface Mount |
Features & Applications
An additional benefit of this proprietary architecture is very low output ripple voltage throughout the entire load range with the use of small output capacitors. The tiny 2 mm x 2 mm Thin MLF® package saves precious board space and requires only three external components.
The MIC23150 has a very low quiescent current of 23 µA and achieves a peak efficiency of 93% in continuous conduction mode.
Features:
- Input voltage: 2.7 V to 5.5 V
- 2.0 A output current
- Up to 93% peak efficiency
- 87% typical efficiency at 1 mA
- 23 µA typical quiescent current
- 4 MHz PWM operation in continuous mode
- Ultra fast transient response
- Low ripple output voltage
- 14 mVpp ripple in HyperLight Load™ mode
- 5 mV output voltage ripple in full PWM mode
- Fully integrated MOSFET switches
- 0.01 µA shutdown current
- Thermal shutdown and current limit protection
- Output Voltage as low as 0.95 V
- 8-pin 2 mm x 2 mm Thin MLF®
- –40 °C to +125 °C junction temperature range
Applications:
- Mobile Handsets
- Portable Media/MP3 players
- Portable navigaion Devices(GPS)
- WiFi/WiMax/WiBro Modules
- Solid state Drives/Memory
- Wireless LAN Cards
- Portable Apllications
Available Packaging
Package Qty:
5000 per Std. Mfr. Pkg
Package Style:
TMLF-8
Mounting Method:
Surface Mount