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Manufacturer Part #
24AA256UIDT-I/ST
EEPROM Memory IC 256Kb (32K x 8) I²C 400kHz 900ns 8-TSSOP
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:2500 per Reel | ||||||||||
| Date Code: | |||||||||||
Microchip 24AA256UIDT-I/ST - Product Specification
Shipping Information:
ECCN:
PCN Information:
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Description of Change:Qualification of MMT as an additional assembly site for selected 24AA044, 24AA256UID, 24LC08B, 25AA256X, 25LC256X, 34AA04 and MCP9805 device families available in 8L TSSOP (4.4mm) package using CuPdAu wire.Pre and Post Change Summary: See attachedImpacts to Data Sheet:NoneChange ImpactNoneReason for Change:To improve on-time delivery performance by qualifying MMT as an additional assembly site using CuPdAu wire.Change Implementation Status:In ProgressEstimated First Ship Date:December 28, 2023 (date code: 2352)Note: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Time Table Summary: See attached
PCN Status: Final NotificationDescription of Change: Qualification of MMT as an additional assembly site for selected 24LC08B, 24AA0xx, 24AA256UID, 25LC256, 25AA256, 34AA04 and MCP9805 device families available in 8L TSSOP (4.4mm) package using CuPdAu bond wire material.Reason for Change: To improve on-time delivery performance by qualifying MMT as an additional assembly site using CuPdAu bond wire material.
Description of Change:Qualification of MMT as an additional assembly site for selected 24LC08B, 24AA0xx, 24AA256UID, 25LC256, 25AA256, 34AA04 and MCP9805 device families available in 8LTSSOP (4.4mm) package using CuPdAu bond wire material.Reason for Change:To improve on-time delivery performance by qualifying MMT as an additional assembly site using CuPdAu bond wire material.
Microchip has released a new Datasheet for the 24AA256/24LC256/24FC256 256K I2C Serial EEPROM Data Sheet of devices.Notification Status: FinalDescription of Change: Added 5-Lead SOT-23 package. Updated MSOP, PDIP, SOIC and SOIJ package drawings.Impacts to Data Sheet: NoneChange Implementation Status: CompleteDate Document Changes Effective: 28 Jul 2022
Part Status:
Available Packaging
Package Qty:
2500 per Reel