Orders shipping outside of United States will be on hold while the company evaluates tariff impacts.
Please contact your salesperson for assistance.
Manufacturer Part #
AT24C128C-MAHM-T
AT24C128C Series 128 Kb (16 K x 8) 1.7 V I2C Compatible Serial EEPROM - UDFN-8
| | |||||||||||
| | |||||||||||
| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:5000 per Reel Package Style:UDFN-8 Mounting Method:Surface Mount | ||||||||||
| Date Code: | 2515 | ||||||||||
Microchip AT24C128C-MAHM-T - Product Specification
Shipping Information:
ECCN:
PCN Information:
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Description of Change: Qualification of CuPdAu as a new wire material, AMK-06 as a new die attach material, and G631BQF as a new mold compound for AT24C128C-MAHM-T and AT24C128C-MAHM-E catalog part numbers (CPN) available in 8L UDFN (2x3x0.6mm) package assembled at ATP7 assembly site.Reason for Change: To improve manufacturability by qualifying CuPdAu as a new wire material, AMK-06 as an new die attach material, and G631BQF as a new mold compound.Estimated First Ship Date: 30 March 2025 (date code: 2513)Revision History: February 14, 2025: Issued final notification.February 21, 2025: Re-issued final notification to remove the pre and post change comparison for the lead frame drawing as there is no change. Revised the "Notification subject", "Description of change", "Qual report title and purpose" to remove the MMT site as there is only a change for ATP7.
Description of Change:Qualification of U08D as a new fabrication location for selected AT24C128C, 24LC128, 24FC128, and 24AA128 device families available in various packages.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying U08D as a new fabrication location.Estimated First Ship Date:27 March 2025 (date code: 2513)Revision History:January 18, 2025: Issued initial notification.February 19, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be March 27, 2025.
Description of Change: Qualification of CuPdAu as a new wire material, AMK-06 as a new die attach material, and G631BQF as a new mold compound for AT24C128C-MAHM-T and AT24C128C-MAHM-E catalog part numbers (CPN) available in 8L UDFN (2x3x0.6mm) package assembled at ATP7 and MMT assembly sites.Reason for Change: To improve manufacturability by qualifying CuPdAu as a new wire material, AMK-06 as an new die attach material, and G631BQF as a new mold compound.Estimated First Ship Date: 30 March 2025 (date code: 2513)
Description of Change:Qualification of U08D as a new fabrication location for selected AT24C128C, 24LC128, 24FC128, and 24AA128 device families available in various packages.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying U08D as a new fabrication location.
Revision History:May 29, 2023: Issued initial notification.August 13, 2023: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on September 7, 2023.February 15, 2024: Re-issued to correct the Pre-change site from ANAP to ATP7Description of Change:Qualification of MTAI as an additional final test location for selected AT24xx, AT25xx, and 24FCxx device families available in 8L UDFN (2x3x0.6mm) package.Reason for Change:To improve manufacturability by qualifying ATP7 as an additional test location.
Revision History:May 29, 2023: Issued initial notification.August 13, 2023: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on September 7, 2023.Description of Change:Qualification of MTAI as an additional final test location for selected AT24xx, AT25xx, and 24FCxx device families available in 8L UDFN (2x3x0.6mm) package.Reason for Change:To improve manufacturability by qualifying MTAI as an additional test location.
PCN Status:Initial NotificationDescription of Change:Qualification of MTAI as an additional final test location for selected AT24xx, AT25xx, and 24FCxx device families available in 8L UDFN (2x3x0.6mm) package.Reason for Change:To improve manufacturability by qualifying MTAI as an additional test location.Estimated Qualification Completion Date:June 2023
Part Status:
Microchip AT24C128C-MAHM-T - Technical Attributes
| Memory Density: | 128kb |
| Memory Organization: | 16 K x 8 |
| Supply Voltage-Nom: | 1.7V to 5.5V |
| Supply Current: | 2mA |
| Clock Frequency-Max: | 1MHz |
| Write Cycle Time-Max (tWC): | 5ms |
| Data Retention: | 100 yr |
| Interface Type: | I2C |
| Access Time-Max: | 450ns |
| Operating Temp Range: | -40°C to +85°C |
| No of Terminals: | 8 |
| Package Style: | UDFN-8 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
5000 per Reel
Package Style:
UDFN-8
Mounting Method:
Surface Mount