
Manufacturer Part #
AT24C64D-MAHM-T
AT24C64D Series 64 Kb (8 K x 8) 1.7 V I2C-Compatible Serial EEPROM - UDFN-8
Microchip AT24C64D-MAHM-T - Product Specification
Shipping Information:
ECCN:
PCN Information:
Description of Change: Qualification of of U08D as a new fabrication site for selected products of the 24AA32A, 24AA32AF, 24LC32A, 24LC32AF, 24AA64, 24AA64F, 24FC64, 24FC64F, 24LC64, 24LC64F, AT24C32D, AT24C32E, AT24C64D and AT24C64B device families.Reason for Change: To improve manufacturability and on-time delivery performance by qualifying U08D as a new fabrication location.Estimated First Ship Date: 23 April 2025 (date code: 2517)Revision History:February 7, 2025: Issued initial notification.March 26, 2025: Issued final notification. Attached the Qualification Report. Provided Estimated First Ship Date on April 23, 2025.
Description of Change: Qualification of palladium-coated copper with gold flash (CuPdAu) as a new wire material and G631BQF as a new mold compound material for AT24C32D-MAHM-T, AT24C32D-MAHM-E, AT24C32E-MAHM-T, AT24C64D-MAHM-T and AT24C64D-MAHM-E catalog part numbers (CPN) available in 8L UDFN (2x3x0.6mm) package assembled at ATP7 assembly site.Reason for Change: To improve manufacturability by qualifying CuPdAu as a new wire material and G631BQF as a new mold compound material.Estimated First Ship Date: 31 March 2025 (date code: 2514)
PCN Status:Initial NotificationDescription of Change:Qualification of of U08D as a new fabrication site for selected products of the 24AA32A, 24AA32AF, 24LC32A, 24LC32AF, 24AA64, 24AA64F, 24FC64, 24FC64F, 24LC64, 24LC64F, AT24C32D, AT24C32E, AT24C64D and AT24C64B device families.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying U08D as a new fabrication location.
Revision History:May 29, 2023: Issued initial notification.August 13, 2023: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on September 7, 2023.February 15, 2024: Re-issued to correct the Pre-change site from ANAP to ATP7Description of Change:Qualification of MTAI as an additional final test location for selected AT24xx, AT25xx, and 24FCxx device families available in 8L UDFN (2x3x0.6mm) package.Reason for Change:To improve manufacturability by qualifying ATP7 as an additional test location.
Revision History:May 29, 2023: Issued initial notification.August 13, 2023: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on September 7, 2023.Description of Change:Qualification of MTAI as an additional final test location for selected AT24xx, AT25xx, and 24FCxx device families available in 8L UDFN (2x3x0.6mm) package.Reason for Change:To improve manufacturability by qualifying MTAI as an additional test location.
PCN Status:Initial NotificationDescription of Change:Qualification of MTAI as an additional final test location for selected AT24xx, AT25xx, and 24FCxx device families available in 8L UDFN (2x3x0.6mm) package.Reason for Change:To improve manufacturability by qualifying MTAI as an additional test location.Estimated Qualification Completion Date:June 2023
PCN Status:Final NotificationPCN Type:Manufacturing ChangeDescription of Change:Qualification of MMT as an additional assembly site for various Atmel products available in 8L UDFN (2x3x0.6mm) package.Impacts to Data Sheet:NoneChange Impact:NoneReason for Change:To improve on-time delivery performance by qualifying MMT as an additional assembly site.Change Implementation Status:In ProgressEstimated First Ship Date:February 17, 2022 (date code: 2208)
Part Status:
Microchip AT24C64D-MAHM-T - Technical Attributes
Memory Density: | 64kb |
Memory Organization: | 8 K x 8 |
Supply Voltage-Nom: | 1.7V to 5.5V |
Supply Current: | 1mA to 3mA |
Clock Frequency-Max: | 1000kHz |
Write Cycle Time-Max (tWC): | 5ms |
Data Retention: | 100 yr |
Interface Type: | I2C |
Access Time-Max: | 900ns |
Operating Temp Range: | -40°C to +85°C |
No of Terminals: | 8 |
Package Style: | UDFN-8 |
Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
5000 per Reel
Package Style:
UDFN-8
Mounting Method:
Surface Mount