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Référence fabricant
93AA56CT-I/SN
EEPROM Serial-Microwire 2K-bit 256 x 8/128 x 16 1.8-5.5V 8-Pin SOIC N Tube
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :3300 par Reel | ||||||||||
| Code de date: | |||||||||||
Microchip 93AA56CT-I/SN - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Microchip has released a new Datasheet for the 93AA56A/B/C, 93LC56A/B/C, 93C56A/B/C - 2-Kbit Microwire Compatible Serial EEPROM Data Sheet of devices. If you are using one of these devices please read the document located at 93AA56A/B/C, 93LC56A/B/C, 93C56A/B/C - 2-Kbit Microwire Compatible Serial EEPROM Data Sheet.Description of Change:Corrected ?1st Line Marking Codes? table.Reason for Change: To improve Productivity.
Revision History:February 7, 2022: Issued final notification.April 6, 2022: Re-issuance of PCN to update the affected CPN list. Update the estimated first shipment date on March 30, 2022.Description of Change:Qualification of 3280 die attach material and new lead frame design for selected products available in 8L SOIC package assembled at MMT assembly site.Pre and Post Change Summary: See attachedImpacts to Data Sheet:NoneChange ImpactNoneReason for Change:To improve productivity by qualifying new lead frame design and die attach material.Change Implementation Status:In ProgressEstimated First Ship Date:March 30, 2022 (date code: 2214)Note: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Time Table Summary: See attached
CCB 4993 Final Notice: Qualification of 3280 die attach material and new lead frame design for selected products available in 8L SOIC package assembled at MMT assembly site.PCN Type: Manufacturing ChangeDescription of Change:Qualification of 3280 die attach material and new lead frame design for selected products available in 8L SOIC package assembled at MMT assembly site.Impacts to Data Sheet: NoneChange Impact: NoneReason for Change:To improve productivity by qualifying new lead frame design and die attach material.Change Implementation Status: In ProgressEstimated First Ship Date: February 28, 2022 (date code: 2210)
NOTICE WITHDRAWALPCN Status: Cancellation of Notification.Reason for Change:Microchip has decided to not qualify a new lead frame design for selected products available in 8L SOIC package using 8390A die attach and palladium coated copper with gold flash (CuPdAu) bond wire material assembled at MMT assembly site.Revision History:February 09, 2021: Issued initial notification.February 01, 2022: Issued cancellation notification.
Statut du produit:
Emballages disponibles
Qté d'emballage(s) :
3300 par Reel