
Manufacturer Part #
25LC010AT-I/OT
25LC010A Series 1Kbit (128 x 8) 5.5 V SMT SPI Bus Serial EEPROM - SOT-23-6
Microchip 25LC010AT-I/OT - Product Specification
Shipping Information:
ECCN:
PCN Information:
Description of Change: Qualification of CuPdAu as a new wire material for selected 24AA014, 24AA025, 24C01C, 24LC014, 24LC025, 24VL014, 24VL025, 25AA010A, 25AA02xx, 25AA040A,25LC010A, 25LC020A, 25LC040A, 34AA02, 34LC02, 34VL02, MTCH101 and PIC10F2xx device families available in 6L SOT-23 package at MTAI assembly site.Reason for Change: To improve productivity by qualifying CuPdAu as a new wire material at MTAI assembly site.
PCN Status:Final NotificationDescription of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material and 8006NS as a new die attach material for selected 24AA0x, 24C01C, 24LC0x, 24VL0x, 25AA0x, 25LC0x, 34AA02, 34LC02, 34VL02, 93AAx, 93C46x, 93C56x, 93C66x, 93C76x, 93C86x, 93LCx, MCP64x, MCP6V1x, MCP6V3x, MCP6V6x, MCP6V7x, MCP6V8x, MCP6V9x, MCP9x, MTCH101, PIC10F20x, PIC10F22x, device families available in 6L and 5L SOT-23 packages assembled at MMT assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material and 8006NS as a new die attach material.Change Implementation Status:In ProgressEstimated First Ship Date:05 December 2024 (date code: 2449)
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected 93LCxxx, 93AAxxx, 93Cxxx, PIC10F2xx, 25LC0xxx, 25AA0xxx, MTCH101,24VL0xx, 24LC0xx, 24AA0xxx, 24C01C, 34VL02, 34LC02, 34AA02, MCP40xx, MCP9800xx, MCP9802xx, MCP738xx, MCP950xx, MCP6Vxxx, and MCP64xx device families available in 6L and 5L SOT-23 packages assembled at MMT assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.
Microchip has released a new Product Documents for the 25AA010A/25LC010A 1-Kbit SPI Bus Serial EEPROM of devices.Notification Status: FinalDescription of Change:1) Added Product Identification System section for Automotive2) Updated DFN, PDIP, SOIC, SOT-23, TDFN and TSSOP package drawings3) Replaced terminology ?Master? and ?Slave? with ?Host? and ?Client?, respectively4) Replaced ?Automotive (E):? designation with ?Extended (E):? designation5) Reformatted some sections for better readabilityImpacts to Data Sheet: See above details.Reason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 11 Feb 2022
Part Status:
Microchip 25LC010AT-I/OT - Technical Attributes
Memory Density: | 1kb |
Memory Organization: | 128 x 8 |
Supply Voltage-Nom: | 2.5V to 5.5V |
Clock Frequency-Max: | 10MHz |
Write Cycle Time-Max (tWC): | 5ms |
Package Style: | SOT-23-6 (SOT-26) |
Mounting Method: | Surface Mount |
Features & Applications
Available Packaging
Package Qty:
3000 per Reel
Package Style:
SOT-23-6 (SOT-26)
Mounting Method:
Surface Mount