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Manufacturer Part #
MX30LF1GE8AB-XKI
1Gb SLC NAND 3CC-FREE 3V 9x11mm and 0.8mm Ball Pitch BGA (-40C to 85C)
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| Mfr. Name: | Macronix | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:220 per Tray | ||||||||||
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Macronix MX30LF1GE8AB-XKI - Product Specification
Shipping Information:
ECCN:
PCN Information:
Change die attach material for ASECL 63CSP package products.Reason of Change:The State of Maine in the United States issued a written notification (H.P.1113 L.D.1503 ) prohibit intentional addition of PFAS Perfluoroalkyl and Polyfluoroalkyl Substances material in all consumer products startingfrom Jan. 2030.Change Description:Please be informed that Macronix is going to replace the die attach material 63CSP package products assembled at ASECL. Before Change : Die attach material (w/ PFAS): Epoxy (Henkel, 2025D)After Change:Die attach material (PFAS-Free): Film (Resonac FH-900)
Part Status:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=MX30LF1GE8AB-XKI&field4=Macronix&field18=https://p1na.futureelectronics.com/p/semiconductors--memory--flash--nand/mx30lf1ge8ab-xki-macronix-6162227
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=MX30LF1GE8AB-XKI&field4=Macronix&field18=https://p1na.futureelectronics.com/p/semiconductors--memory--flash--nand/mx30lf1ge8ab-xki-macronix-6162227
Available Packaging
Package Qty:
220 per Tray