
Manufacturer Part #
PIC16LF18344T-I/SS
7KB, 512B RAM, 256B EEPROM, 10b ADC, Comp, 5b DAC, 10b PWM, CCP, CLC, NCO, CWG
Microchip PIC16LF18344T-I/SS - Product Specification
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Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected PIC16F18344, PIC16F18444, PIC16F18445, PIC16F18446, PIC16F18345, PIC18F16Q20, PIC18F14Q40, PIC18F15Q40, PIC18F14Q41, PIC18F15Q41, PIC16F18346, PIC16F15345, AVR32DU20, AVR16DU20, PIC16F15344, PIC18F14Q20 and PIC18F15Q20 device families available in 20L SSOP (.209in) package at MTAI assembly site.Reason for Change: To improve manufacturability by qualifying coated copper with gold flash (CuPdAu) as a new bond wire material
Microchip has released a new Document for the PIC16(L)F18324/18344 Family Silicon Errata and Data Sheet Clarifications of devices. Notification Status: FinalDescription of Change:Updated the document format to the current Microchip publication standard, module numbers under silicon errata have been renumbered accordingly; added Data Sheet Clarification 2.1.Impacts to Data Sheet: NoneReason for Change: To Improve Productivity Change Implementation Status: CompleteDate Document Changes Effective: 11 Feb 2025
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Available Packaging
Package Qty:
1600 per Reel