
Manufacturer Part #
PIC24FJ128GA702-I/ML
PIC PIC 24F Microcontroller IC 16-Bit 32MHz 128KB (43K x 24) FLASH 28-QFN (6x6)
Microchip PIC24FJ128GA702-I/ML - Product Specification
Shipping Information:
ECCN:
PCN Information:
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Cancellation notification:Revision History:October 23, 2020: Issued initial notification.March 29, 2022: Issued cancellation notificationDescription of Change:This qualification was originally performed to qualify palladium coated copper with gold flash (CuPdAu) bond wire for selected products available in 64L QFN (9x9x0.9mm) and 28L QFN (6x6x0.9mm) packages at MTAI.assembly site.Reason for Change:Microchip has decided to not qualify palladium coated copper with gold flash (CuPdAu) bond wire for selected products available in 64L QFN (9x9x0.9mm) and 28L QFN (6x6x0.9mm) packages at MTAI assembly site.
Part Status:
Microchip PIC24FJ128GA702-I/ML - Technical Attributes
Family Name: | PIC24F |
Core Processor: | PIC |
Program Memory Type: | Flash |
Flash Size (Bytes): | 128kB |
RAM Size: | 16kB |
Speed: | 32MHz |
No of I/O Lines: | 22 |
InterfaceType / Connectivity: | IrDA/I2C/LINbus/SPI/UART/USART |
Peripherals: | Brownout Reset/Brown-out Detect/DMA/I2S/LVD/POR/PWM |
Supply Voltage: | 2V to 3.6V |
Operating Temperature: | -40°C to +85°C |
On-Chip ADC: | 10-chx12-bit |
Package Style: | QFN-28 |
Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
61 per Tube
Package Style:
QFN-28
Mounting Method:
Surface Mount