Manufacturer Part #
16-bit PIC24F, 16 MIPS, 64KB Flash, 16KB RAM, 28 pin
Description of Change: 1) Added silicon errata issues 17 (Oscillator), 18 (CCP), 19 (Oscillator), 20 (Oscillator), 21 (I 2C) and 22 (I 2C). 2) Removed data sheet clarifications 2 (Flash Program Memory), 3 (Memory Organization) and 4 (Capture/ Compare/PWM/Timer Modules (MCCP)) because these were corrected in the current device data sheet. 3) Added data sheet clarification 2 (Oscillator)NOTE: Please be advised that this is a change to the document only the product has not been changed.
Data Sheet - PIC24FJ256GA705 Family Data SheetTop of Form 1Notification Status: FinalDescription of Change: This revision incorporates the following updates:1) Sections: a) Adds Qualification and Class B Support information to page 1.b) Updates the notes in all pin diagrams, updates Section 4.1.1 �Program Memory Organization� and Section 6.4 �Enhanced In-Circuit Serial Programming�c) Removes all references of the CCPxSTATH status register.2) Tables:a) Updates Table 4-1, Table 4-6, Table 4-7, Table 8-1, Table 8-2 and Table 10-1. b) Adds Table 32-24 through Table 32-33.3) Figures:a) Updates Figure 3-2. b) Adds Figure 32-5 through Figure 32-18.4) Registers:a) Updates Register 7-1.Impacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 24 March 2020NOTE: Please be advised that this is a change to the document only the product has not been changed.Markings to Distinguish Revised from Unrevised Devices: N/A
Microchip has released a new DeviceDoc for the PIC24FJ256GA705 Family Data Sheet of devices.Description of Change:1) Updates Referenced Sources, Section 5.0 Direct Memory Access Controller (DMA), Section 5.4 DMA Registers, Section 9.7.2 Crystal Selection, Section 10.2.4 Low-Voltage Retention Regulator, Section 21.0 Real-Time Clock and Calendar (RTCC) with Timestamp, Section 29.2 Unique Device Identifier (UDID) and Section 29.8 Customer OTP Memory. 2) Replaces the 28-Pin UQFN M6 drawings with 28-Pin UQFN MV drawings in Section 33.0 Packaging Information; therefore, Product Identification System is also updated.3) Updates Table 1, Table 1-3, Table 8-2, Table 10-1, Table 16-2, Table 29-5, Table 31-1, Table 32-12 and Table 32-24.4) Updates Register 8-6, Register 10-2, Register 14-1, Register 16-1, Register 17-1, Register 17-5, Register 19-2, Register 22-3, Register 22-4, Register 26-1, Register 27-3 and Register 28-15) Updates Figure 17-1, Figure 18-1, Figure 26-1 and Figure 28-1.6) Updates Example 19-1.Reason for Change: To Improve ManufacturabilityChange Implementation Status: CompleteDate Document Changes Effective: 26 March 2018NOTE: Please be advised that this is a change to the document only the product has not been changed.
Microchip has released a new DeviceDoc for the PIC24FJ256GA705 Family Silicon Errata and Data Sheet Clarification of devices.Description of Change: 1) Addition of silicon die revision A4. 2) Added silicon errata issues 7 (I 2C), 8 (I 2C), 9 (I 2C), 10 (I 2C), 11 (I 2C), 12 (I 2C), 13 (I 2C), 14 (UART) and 15 (ADC) 3) Incorporated all data sheet clarifications into the �PIC24FJ256GA705 Family Data Sheet� (DS30010118C).Impacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteEstimated First Ship Date: 01 May 2018
Cancellation Notice: For the qualification of ASE as an additional assembly site for selected products available in 28L UQFN package. Revision History:June 01, 2017: Issued initial notification.January 29, 2018: Issued cancellation notice for the proposed qualification of ASE as an additional assembly site for selected products available in 28L UQFN package.Reason for Issuing Cancellation Notice:Microchip has decided not to qualify ASE as an additional assembly site for selected products available in 28L UQFN package.