
Manufacturer Part #
PIC32MK0512GPG064-I/R4X
PIC32MK: 512 kB Flash 64 kB RAM MIPS32 microAptiv 32-Bit Microcontroller-VQFN-64
Microchip PIC32MK0512GPG064-I/R4X - Product Specification
Shipping Information:
ECCN:
PCN Information:
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Notification Status: FinalDescription of Change: The following new Data Sheet Clarification was added: • PackagingImpacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 30 Jan 2024NOTE: Please be advised that this is a change to the document only the product has not been changed.Markings to Distinguish Revised from Unrevised Devices: N/A
Microchip has released a new Errata for the PIC32MK General Purpose and Motor Control GPG/MCJ with CAN FD Family Silicon Errata and Data Sheet Clarifications of devices. Notification Status: FinalDescription of Change: Revision C - July 20221) The SPI, I2S, and I2C standards use the terminology "Master" and "Slave". 2) The equivalent Microchip terminology used in this document is "Host" and "Client" respectively. 3) These terms have been updated throughout this document for this revision. 4) The following silicon errata issues were added: ? FLASH: 2.4.1 RTSPImpacts to Data Sheet: NoneChange Implementation Status: CompleteDate Document Changes Effective: 25 Jul 2022
Part Status:
Microchip PIC32MK0512GPG064-I/R4X - Technical Attributes
Family Name: | PIC32MK |
Core Processor: | MIPS32 microAptiv |
Program Memory Type: | Flash |
Flash Size (Bytes): | 512kB |
RAM Size: | 64kB |
Speed: | 120MHz |
No of I/O Lines: | 53 |
InterfaceType / Connectivity: | CANbus/IrDA/I2C/LINbus/PMP/SPI/UART/USART |
Peripherals: | Brown-out Detect/DMA/I2S/POR/Reset/Watchdog |
Supply Voltage: | 2.3V to 3.6V |
Operating Temperature: | -40°C to +85°C |
On-Chip ADC: | 18-chx12-bit |
On-Chip DAC: | 2-chx12-bit |
Package Style: | VQFN-64 |
Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
260 per Tray
Package Style:
VQFN-64
Mounting Method:
Surface Mount