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Manufacturer Part #
PIC12F1571-E/RF
IC MCU 8BIT 1.75KB FLASH 8UDFN
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:120 per Tube | ||||||||||
| Date Code: | |||||||||||
Product Specification Section
Microchip PIC12F1571-E/RF - Product Specification
Shipping Information:
Item cannot ship to certain countries. See List
Item cannot ship to following countries:
ECCN:
3A991.a.2
This item may be subject to export licensing controls.
PCN Information:
File
Date
Wire Bond Method/Material Change
05/28/2025 Details and Download
Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as an additional bond wire material for selected PIC12F1822, PIC12F1840, PIC12F1571, PIC12F1572, PIC16F18313 and PIC16F15313 device families available in 8L UDFN (3x3x0.5mm) package at MMT assembly site.Reason for Change: To improve manufacturability by qualifying CuPdAu as an additional bond wire material.Estimated Qualification Completion Date: June 2025
Part Status:
Active
Active
Pricing Section
Global Stock:
0
USA:
0
On Order:
0
Factory Lead Time:
7 Weeks
Quantity
Unit Price
120
$0.76
240
$0.75
360
$0.74
480
$0.735
600+
$0.715
Product Variant Information section
Available Packaging
Package Qty:
120 per Tube