
Manufacturer Part #
PIC16LF627A-I/SO
PIC16 Series 1.75 KB Flash 224 B RAM 20 MHz 8-Bit Microcontroller - SOIC-18
Product Specification
Shipping Information:
ECCN:
PCN Information:
Notification subject: CCB 3217 and CCB 3217.001 Final Notice: Qualification of palladium coated copper with gold flash (CuPdAu) bond wire in selected products available in 18L and 28L SOIC package at MTAI assembly sitePCN Status:Final notificationPCN Type: Manufacturing ChangeDescription of Change: Qualification of palladium coated copper with gold flash (CuPdAu) bond wire in selected products available in 18L and 28L SOIC package at MTAI assembly sitePre Change: Using palladium coated copper wire (PdCu) bond wirePost Change: Using palladium coated copper with gold flash (CuPdAu) bond wireImpacts to Data Sheet: NoneChange Impact: NoneReason for Change: To improve productivity by qualifying palladium coated copper with gold flash (CuPdAu) bond wireChange Implementation Status: In ProgressEstimated First Ship Date: September 16, 2018 (date code: 1838)NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Method to Identify Change: Traceability codeRevision History: March 08, 2018: Issued initial notification.August 16, 2018: Issued final notification. Attached the Qualification Report. Revised the affected parts list. Provided estimated first ship date on September 16, 2018. The change described in this PCN does not alter Microchip's
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) bond wire in selected products available in 18L and 28L SOIC package at MTAI assembly site.Pre Change: Using palladium coated copper wire (PdCu) bond wire.Post Change:Using palladium coated copper with gold flash (CuPdAu) bond wireReason for Change:To improve productivity by qualifying palladium coated copper with gold flash (CuPdAu) bond wire Estimated Qualification Completion Date:April 2018
Initial Notice: Qualification of palladium coated copper (PdCu) bond wire and 3280 die attach epoxy in selected products of the 150K and 160K wafer technologies available in 18L SOICDescription of Change:Qualification of palladium coated copper (PdCu) bond wire and 3280 die attach epoxy in selected products of the 150K and 160K wafer technologies available in 18L SOIC package at MTAI assembly site.Pre Change: Gold wire and 8390A die attach epoxyPost Change: PdCu wire and 3280 die attach epoxyReason for Change:To improve manufacturability and qualify PdCu bond wire at MTAI assembly site.
Part Status:
Technical Attributes
Family Name: | PIC16 |
Core Processor: | PIC |
Program Memory Type: | Flash |
Flash Size (Bytes): | 1.75kB |
RAM Size: | 224B |
Speed: | 20MHz |
No of I/O Lines: | 16 |
InterfaceType / Connectivity: | USART |
Peripherals: | Analog Comparators/PWM/USART/Watchdog |
Number Of Timers: | 3 |
Supply Voltage: | 2V to 5.5V |
Operating Temperature: | -40°C to +85°C |
Watchdog Timers: | 1 |
Package Style: | SOIC-18 |
Mounting Method: | Surface Mount |
Features & Applications
The PIC16LF627A-I/SO is a part of PIC16LF series Microcontroller. It has an operating temperature ranging from -40ºC to +125ºC. It comes in SOIC-18 package.
The PIC16F627A features 4MHz internal oscillator, 128 bytes of EEPROM data memory, a capture/compare/PWM, a USART, 2 Comparators and a programmable voltage reference that make it ideal for analog/integrated level applications in automotive, industrial, appliances and consumer application.
Features:
- High-Performance RISC CPU:
- Operating speeds from DC – 20 MHz
- Interrupt capability
- 8-level deep hardware stack
- Direct, Indirect and Relative Addressing modes
- Special Microcontroller Features:
- Internal and external oscillator options:
- Precision internal 4 MHz oscillator factory calibrated to ±1%
- Low-power internal 48 kHz oscillator
- External Oscillator support for crystals and resonators
- Power-saving Sleep mode
- Programmable weak pull-ups on PORTB
- Multiplexed Master Clear/Input-pin
- Watchdog Timer with independent oscillator for reliable operation
- Peripheral Features:
- 16 I/O pins with individual direction control
- High current sink/source for direct LED drive
- Analog comparator module with:
- Two analog comparators
- Programmable on-chip voltage reference (VREF) module
- Selectable internal or external reference
Available Packaging
Package Qty:
42 per Tube
Package Style:
SOIC-18
Mounting Method:
Surface Mount