
Manufacturer Part #
PIC18F25K83-I/SS
ECAN, 28KB Flash, 2KB RAM, 1K EE, 12-bit ADC2, Vector Interrupts, DMA, Comp,
Microchip PIC18F25K83-I/SS - Product Specification
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Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material and 3280 as a new die attach material for selected PIC16F18xx, PIC18F24xx, PIC18F25xx, PIC18F26xx, PIC16F15xx, PIC18F27xx, AVR64DU2xx, AVR32DA2xx, AVR64DD2xx, AVR32DD2xx, AVR16DD2xx, PIC16F19xx, AVR128DBxx, AVR64DB2xx, AVR32DB2xx, AVR128DAxx, AVR64DA2xx, AVR32DU2xx and AVR16DU2xx device families available in 28L SSOP (.209in) at MTAI assembly site.Reason for Change: To improve productivity by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material and 3280 as a new die attach material.
Microchip has released a new Document for the PIC18(L)F25/26K83 Family Silicon Errata and Data Sheet Clarifications of devices. Notification Status: FinalDescription of Change: Data Sheet Clarifications: Added Module 2.Impacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 29 Feb 2024
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47 per Tube