
Manufacturer Part #
PIC18F27K40T-I/SS
PIC18F Series 128 KB Flash 3.6 KB RAM 64 MHz 8-Bit Microcontroller - SSOP-28
Microchip PIC18F27K40T-I/SS - Product Specification
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Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material and 3280 as a new die attach material for selected PIC16F18xx, PIC18F24xx, PIC18F25xx, PIC18F26xx, PIC16F15xx, PIC18F27xx, AVR64DU2xx, AVR32DA2xx, AVR64DD2xx, AVR32DD2xx, AVR16DD2xx, PIC16F19xx, AVR128DBxx, AVR64DB2xx, AVR32DB2xx, AVR128DAxx, AVR64DA2xx, AVR32DU2xx and AVR16DU2xx device families available in 28L SSOP (.209in) at MTAI assembly site.Reason for Change: To improve productivity by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material and 3280 as a new die attach material.
Microchip has released a new Errata for the PIC18(L)F27/47K40 Family Silicon Errata and Data Sheet Clarifications of devices.Description of Change: Removed 2.1.2. Added silicon errata 2.1.6, 2.1.7, 2.1.8, 2.4.2, 2.5.3, 2.10.1, 2.11.1, 2.12.1. Removed Data Sheet clarification for Operating speed. Modified 3.2.1 (Electrical Specification) ADC Offset Error updated to -+3.0LSb.Impacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 29 Sep 2022
Description of Change: - Added Module 3.3 Double Sample Conversions, 12 Central Processing Unit (CPU), and 12.1 FSR Shadow Registers..Impacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 2 May 2022NOTE: Please be advised that this is a change to the document only the product has not been changed.
Part Status:
Available Packaging
Package Qty:
2100 per Reel