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Manufacturer Part #
MCP79401-I/MS
MCP79401: General purpose I2CTM Compatible real-time clock, -40C to +85C, MSOP-8
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:100 per Tube | ||||||||||
| Date Code: | |||||||||||
Product Specification
Shipping Information:
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PCN Information:
Revision History:November 28, 2017: Issued initial notification.December 22, 2017: Re-issued initial notification to correct the Pre and Post Change summary from CuPdAu wire to Au wire.May 23, 2018: Issued final notification. Attached the Qualification Report. Revised the affected parts list. Provided estimated first ship date on June 23, 2018.July 09, 2018: Resend PCN to update qual report title.Description of Change:Qualification of MMT as an additional assembly site for selected products available in 8L MSOP package using gold (Au) bond wire.Pre Change: Assembled at MTAI assembly site.Post Change: Assembled at MTAI or MMT assembly site.Reason for Change:To improve productivity by qualifying MMT as an additional assembly site.Estimated First Ship Date: June 23, 2018 (date code: 1825)
Revision History:April 23, 2018: Issued initial notification.June 27, 2018: Issued final notification. Attached the Qualification Report and provided estimated first ship date to be on July 27, 2018.July 09, 2018: Re-issued final notification to correct the attached Qualification report.Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) bond wire in selected products of the 160K wafer technology available in 8L MSOP package at MTAI assembly site.Pre Change: Using gold (Au) bond wire.Post Change: Using palladium coated copper with gold flash(CuPdAu) bond wire.Reason for Change:To improve on-time delivery performance by qualifying palladium coated copper with gold flash(CuPdAu) bond wire.Estimated First Ship Date:July 27, 2018 (date code: 1830)
CCB 3230 Final Notice: Qualification of palladium coated copper with gold flash (CuPdAu) bond wire in selected products of the 160K wafer technology available in 8L MSOP package at MTAI assembly site. PCN Status: Final notification. PCN Type: Manufacturing ChangeDescription of Change: Qualification of palladium coated copper with gold flash (CuPdAu) bond wire in selected products of the 160K wafer technology available in 8L MSOP package at MTAI assembly site. Pre Change: Using gold (Au) bond wirePost Change: Using palladium coated copper with gold flash(CuPdAu) bond wire.
Description of Change:Qualification of MMT as an additional assembly site for selected products available in 8L MSOP package using gold (Au) bond wire.Pre Change:Assembled at MTAI assembly site.Post Change:Assembled at MTAI or MMT assembly site.Reason for Change:To improve productivity by qualifying MMT as an additional assembly site.Estimated First Ship Date:June 23, 2018 (date code: 1825)
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) bond wire in selected products of the 160K wafer technology available in 8L MSOP package at MTAI assembly site. Pre Change: Using gold (Au) bond wirePost Change: Using palladium coated copper with gold flash(CuPdAu) bond wire.Reason for Change:To improve on-time delivery performance by qualifying palladium coated copper with gold flash (CuPdAu) bond wire.Estimated Qualification Completion Date: June 2018
Microchip has released a new DeviceDoc for the MCP79400/01/02 Battery-Backed I2C RTCC w/ SRAM and Protected EEPROM of devices.Description of Change: 1) Added detailed description of OUIsReason for Change: To Improve ManufacturabilityDate Document Changes Effective: 03 Mar 2018NOTE: Please be advised that this is a change to the document only the product has not been changed.
Microchip has released a new DeviceDoc for the MCP7940X Family Silicon Errata of devices. Description of Change: Added Silicon Issue 3 (date value changing on month write).Reason for Change: To Improve ProductivityDate Document Changes Effective: 21 Feb 2018NOTE: Please be advised that this is a change to the document only the product has not been changed.
Description of Change:Qualification of MMT as an additional assembly site for selected products available in 8L MSOP package using gold (Au) bond wire.Pre Change:Assembled at MTAI assembly site.Post Change:Assembled at MTAI or MMT assembly site.Reason for Change:To improve productivity by qualifying MMT as an additional assembly site.Estimated Qualification Completion Date:January 2018
Description of Change:Qualification of MMT as an additional assembly site for selected products available in 8L MSOP package using gold (Au) bond wire.Pre Change: Assembled at MTAI assembly site.Post Change:Assembled at MTAI or MMT assembly site.Reason for Change:To improve productivity by qualifying MMT as an additional assembly site.Estimated Qualification Completion Date:January 2018
Product Lifecycle:
Available Packaging
Package Qty:
100 per Tube
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