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Manufacturer Part #
MCP6009-E/SL
IC OPAMP GP 4 CIRCUIT 14SOIC
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:57 per Std. Mfr. Pkg | ||||||||||
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Microchip MCP6009-E/SL - Product Specification
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Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new wire material and QMI519 as a new die attach material for selected MCP6007, MCP6009, MCP6477, MCP6479, MCP6487 and MCP6497 device families available in 8L and 14L SOIC (.150in) packages.Reason for Change: To improve productivity by qualifying palladium coated copper with gold flash (CuPdAu) as a new wire material and QMI519 as a new die attach material. Estimated Qualification Completion Date: December 2025
Part Status:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=MCP6009-E/SL&field4=Microchip&field18=https://p1na.futureelectronics.com/p/semiconductors--various-parts-semiconductors/mcp6009-e-sl-microchip-C194993517
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=MCP6009-E/SL&field4=Microchip&field18=https://p1na.futureelectronics.com/p/semiconductors--various-parts-semiconductors/mcp6009-e-sl-microchip-C194993517
Available Packaging
Package Qty:
57 per Std. Mfr. Pkg