Panasonic provides a portfolio of thermal management products which offer a range of characteristics and performance specifications to meet the requirements of different applications for thermal conductivity and mechanical properties.
Nano Silica Balloon Insulator Sheet or NASBIS is a thin, flexible heat-insulating material composed of silica aerogel and a polyester fiber that has excellent thermal isolation properties. The thermal conductivity of NASBIS is comparable to that of air, making it an attractive material for heat insulation. NASBIS sheets protect thermally weak products from heat. It also helps maintain a uniform temperature throughout a device.
Graphite-PAD is a silicone resin-based pad composed of graphite flakes oriented in the vertical z-axis direction. Highly compressible, a Graphite-PAD can serve as a Thermal Interface Material (TIM) between a heat-sink and an IC.
Pyrolytic Graphite Sheet, or PGS, is a very thin TIM which offers high thermal conductivity. Made from graphite polymer fi lm, it is ideal for thermal management in limited spaces. It can also be used to provide supplemental heat dissipation in addition to a conventional heat-sink. The flexible material may be cut into custom shapes.
Soft PGS is an ideal TIM because of its combination of high thermal conductivity and high compressibility. When compressed, it reduces contact thermal resistance between rough surfaces in thin spaces.
Custom-cut to IGBT module footprints, Soft PGS contributes to the long life and high performance of power modules, since it provides high thermostability and reliability in thermally sensitive areas. Soft PGS is easy to install with a one- or two-step process that requires much less labor than the use of thermal grease entails.
Semi-Sealing Material, or SSM, is a silicone-free thermoplastic resin which absorbs heat, and which can conform to any rough or uneven surface with the right applied pressure. SSM material allows PGS to be used in areas in which the TIM needs to be compressed to avoid the risk of high thermal contact resistance.