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Référence fabricant
APT75GP120B2G
APT75GP120B2G Single 1200 V 100 A 1042 W 320 nC POWER MOS 7® IGBT - TO-247-3
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :1 par Bulk Style d'emballage :T-MAX Méthode de montage :Through Hole | ||||||||||
| Code de date: | |||||||||||
Microchip APT75GP120B2G - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Description of Change: Qualification of Tin (Sn) as a new terminal plating for selected APL502, APL602, APT100, APT10M, APT11N, APT120, APT13G, APT150, APT15D, APT15G, APT200, APT20G, APT20M, APT25G, APT30D, APT30G, APT30M, APT30S, APT33G, APT35G, APT401, APT40D, APT40G, APT40M, APT45G, APT47N, APT501, APT502, APT50G, APT50M, APT601, APT602, APT603, APT60D, APT60M, APT60S, APT65G, APT75G, APT801, APT802, APT803, APT804, APT805, APT806, APT807, APT80G, APT94N, CC1105, CC1215, CC2515, CC3037, CC3038, CC3069 and CC3125 Microsemi Power Discrete TO-247 products.Reason for Change: To improve productivity by a change in terminal platingEstimated First Ship Date: 02 January 2026 (date code: 2601)
Description of Change:Initial Release/Please be advised that this is a change to the document only the product has not been changed. Microchip has released a new Document for the 1200 V Power MOS 7® Punch-through IGBT Collector Cut-off Current @ 125°C of devices. If you are using one of these devices please read the documentlocated at 1200 V Power MOS 7® Punch-through IGBT Collector Cut-off Current @ 125°C.1200 V Power MOS 7® Punch-through IGBT Collector Cut-off Current @ 125°CReason for Change:
Description of Change:Qualification of MG15F-0140B as a new mold compound material for various products available in SOT-227, TO-264, TO-268 and TO-247 packages at TEAM assembly site.Reason for Change:To improve productivity by qualifying MG15F-0140B as a new mold compound material at TEAM assembly site.***Issued final notification. Provided estimated first ship date to be on June 29, 2024.
PCN Status:Final NotificationDescription of Change:Qualification of MG15F-35AB and MG15F-0140B as a new mold compound material for various products available in TO-264, SOT-227 and TO-247 packages at FSTS assembly site.Reason for Change:To improve productivity by qualifying MG15F-35AB and MG15F-0140B as a new mold compound.Change Implementation Status:In ProgressEstimated First Ship Date:June 29, 2024 (date code: 2426)
PCN Status:Initial NotificationDescription of Change:Qualification of MG15F-35AB and MG15F-0140B as a new mold compound material for various products available in TO-264, SOT-227 and TO-247 packages at FSTS assembly site.Reason for Change:To improve productivity by qualifying MG15F-35AB and MG15F-0140B as a new mold compound material at FSTS assembly site.
Description of Change:Qualification of MG15F-0140B as a new mold compound material for various products available in SOT-227, TO-264, TO-268 and TO-247 packages at TEAM assembly site.Reason for Change:To improve productivity by qualifying MG15F-0140B as a new mold compound material at TEAM assembly site.
Statut du produit:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=APT75GP120B2G&field4=Microchip&field18=https://p1na.futureelectronics.com/de/p/semiconductors--discretes--transistors--igbts/apt75gp120b2g-microchip-7032098
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=APT75GP120B2G&field4=Microchip&field18=https://p1na.futureelectronics.com/de/p/semiconductors--discretes--transistors--igbts/apt75gp120b2g-microchip-7032098
Microchip APT75GP120B2G - Caractéristiques techniques
| CE Voltage-Max: | 1200V |
| Collector Current @ 25C: | 100A |
| Power Dissipation-Tot: | 1042W |
| Gate - Emitter Voltage: | 20V |
| Pulsed Collector Current: | 300A |
| Collector - Emitter Saturation Voltage: | 3.3V |
| Turn-on Delay Time: | 20ns |
| Turn-off Delay Time: | 163s |
| Qg Gate Charge: | 320nC |
| Leakage Current: | 100nA |
| Input Capacitance: | 7035pF |
| Thermal Resistance: | 0.12°C/W |
| Operating Temp Range: | -55°C to +150°C |
| No of Terminals: | 3 |
| Style d'emballage : | T-MAX |
| Méthode de montage : | Through Hole |
Emballages disponibles
Qté d'emballage(s) :
1 par Bulk
Style d'emballage :
T-MAX
Méthode de montage :
Through Hole