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Manufacturer Part #
MIC2026-2YM-TR
MIC2026 Series Dual Channel 5.5 V 170mOhm Power Distribution Switch - SOIC-8
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: |
Product Variant Information section
Available PackagingPackage Qty:2500 per Package Style:SOIC-8 Mounting Method:Surface Mount |
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| Date Code: | 2227 | ||||||||||
Microchip MIC2026-2YM-TR - Product Specification
Shipping Information:
HTS Code:
ECCN:
PCN Information:
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material, G700LTD as a new mold compound material and 8303A as a new die attach material for selected MIC2012, MIC2025, MIC2026, MIC2042, MIC2043, MIC2075, MIC2076, MIC2172, MIC2536, MIC2544, MIC2544A, MIC2545A, MIC2548, MIC2548A, MIC2549A, MIC2582, MIC2587, MIC29201, MIC29204, MIC2951, MIC2954, MIC3172, MIC3203, MIC38C42, MIC38C43, MIC38C44, MIC38C45, MIC38HC42, MIC38HC43, MIC38HC44, MIC38HC45, MIC4223, MIC4224, MIC4225, MIC4801, MIC5014, MIC5015, MIC5020, MIC5021, MIC5156, MIC5200, MIC5201 and MIC5202 device families available in 8L SOIC (.150in) package.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material, G700LTD as a new mold compound material and 8303A as a new die attach material.
Microchip has released a new Datasheet for the MIC2026 Family Data Sheet of devices.Description of Change:?Updated Section ?Features?.?Updated ESD Ratings in Section ?Electrical Characteristics?.?Updated Package Drawing in Section 6.0 ?Packaging Information?.Reason for Change: To improve productivity.
Part Status:
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Microchip MIC2026-2YM-TR - Technical Attributes
| Configuration: | High Side |
| Input Voltage: | 2.7V to 5.5V |
| No of Elements: | Dual |
| On-state Resistance-Max: | 170mΩ |
| Rated Current-Max: | 1.25A |
| Type: | Power Distribution Switch |
| Operating Temp Range: | -40°C to +85°C |
| Turn-off Delay Time: | 100µs |
| Turn-on Delay Time: | 5ms |
| Current - Limit: | 1.25A |
| Rise Time: | 4.9ms |
| Fall Time: | 100µs |
| Package Style: | SOIC-8 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
2500 per
Package Style:
SOIC-8
Mounting Method:
Surface Mount