Référence fabricant
MIC2026-2YM-TR
MIC2026 Series Dual Channel 5.5 V 170mOhm Power Distribution Switch - SOIC-8
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: |
Product Variant Information section
Emballages disponiblesQté d'emballage(s) :2500 par Style d'emballage :SOIC-8 Méthode de montage :Surface Mount |
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| Code de date: | 2227 | ||||||||||
Microchip MIC2026-2YM-TR - Spécifications du produit
Informations de livraison:
Code HTS:
ECCN:
Informations PCN:
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material, G700LTD as a new mold compound material and 8303A as a new die attach material for selected MIC2012, MIC2025, MIC2026, MIC2042, MIC2043, MIC2075, MIC2076, MIC2172, MIC2536, MIC2544, MIC2544A, MIC2545A, MIC2548, MIC2548A, MIC2549A, MIC2582, MIC2587, MIC29201, MIC29204, MIC2951, MIC2954, MIC3172, MIC3203, MIC38C42, MIC38C43, MIC38C44, MIC38C45, MIC38HC42, MIC38HC43, MIC38HC44, MIC38HC45, MIC4223, MIC4224, MIC4225, MIC4801, MIC5014, MIC5015, MIC5020, MIC5021, MIC5156, MIC5200, MIC5201 and MIC5202 device families available in 8L SOIC (.150in) package.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material, G700LTD as a new mold compound material and 8303A as a new die attach material.
Microchip has released a new Datasheet for the MIC2026 Family Data Sheet of devices.Description of Change:?Updated Section ?Features?.?Updated ESD Ratings in Section ?Electrical Characteristics?.?Updated Package Drawing in Section 6.0 ?Packaging Information?.Reason for Change: To improve productivity.
Statut du produit:
Microchip MIC2026-2YM-TR - Caractéristiques techniques
| Configuration: | High Side |
| Input Voltage: | 2.7V to 5.5V |
| No of Elements: | Dual |
| On-state Resistance-Max: | 170mΩ |
| Rated Current-Max: | 1.25A |
| Type: | Power Distribution Switch |
| Operating Temp Range: | -40°C to +85°C |
| Turn-off Delay Time: | 100µs |
| Turn-on Delay Time: | 5ms |
| Current - Limit: | 1.25A |
| Rise Time: | 4.9ms |
| Fall Time: | 100µs |
| Style d'emballage : | SOIC-8 |
| Méthode de montage : | Surface Mount |
Emballages disponibles
Qté d'emballage(s) :
2500 par
Style d'emballage :
SOIC-8
Méthode de montage :
Surface Mount