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Manufacturer Part #
R5F562TAEDFP#V1
RX62T 3V 256KB/16KB LQFP100
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| Mfr. Name: | Renesas | ||||||||||
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Product Variant Information section
Available PackagingPackage Qty:90 per Tray |
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Renesas R5F562TAEDFP#V1 - Product Specification
Shipping Information:
HTS Code:
ECCN:
PCN Information:
Description of Change: Applicable products: RA6M3, SYNERGY-S5D9, SYNERGY-S7G2 LQFP products and RX62x, RX64M, RX71M LFQPF/LQFP productsThe back-end factory: Renesas Semiconductor (Suzhou) Co., Ltd (?Suzhou?).Changes: The die-bond material will be changed.The new die-bond material is a proven one for mass production at ?Suzhou?.Reason for Change: To change to an alternate material due to the termination of supply of the material by the die-bond materials manufacturer.
Part Status:
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https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=R5F562TAEDFP#V1&field4=Renesas&field18=https://p1na.futureelectronics.com/en/p/semiconductors--microcontrollers--32-bit/r5f562taedfp-v1-renesas-C022882576
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https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=R5F562TAEDFP#V1&field4=Renesas&field18=https://p1na.futureelectronics.com/en/p/semiconductors--microcontrollers--32-bit/r5f562taedfp-v1-renesas-C022882576
Available Packaging
Package Qty:
90 per Tray