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Référence fabricant
MCP4716A2T-E/CH
SINGLE, 10-BIT NV DAC WITH EXT VREF AND I2C INTERFACE
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :3000 par Reel Style d'emballage :SOT-23-6 (SOT-26) Méthode de montage :Surface Mount | ||||||||||
| Code de date: | |||||||||||
Microchip MCP4716A2T-E/CH - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
CCB 7276 Final NoticeDescription of Change: Qualification palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected MCP3421, MCP4725, MCP4726, MCP4706, MCP4716, MCP9510, MCP47DA1, MCP4023, MCP4022, MCP4013, MCP4012, and MCP3425 device families available in 6L SOT-23 package.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.Estimated First Ship Date: 07 March 2025 (date code: 2510)Revision History: November 13, 2024: Issued initial notification.January 31, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on March 07, 2025.
Description of Change: Qualification palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected MCP3421, MCP4725, MCP4726, MCP4706, MCP4716, MCP9510, MCP47DA1, MCP4023, MCP4022, MCP4013, MCP4012, and MCP3425 device families available in 6L SOT-23 package.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.
PCN Status:Final NotificationDescription of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected MCP3421xxx, MCP3425Axx, MCP401xx, MCP402xx, MCP4706Axx, MCP4716Axx, MCP4725Axx, MCP4726Axx, MCP47DA1T, and MCP9510xx device families available in 6L SOT-23 package assembled at MMT assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.Change Implementation Status:In ProgressEstimated First Ship Date:February 16, 2023 (date code: 2307)
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected MCP3421xxx, MCP3425Axx, MCP401xx, MCP402xx, MCP4706Axx, MCP4716Axx, MCP4725Axx, MCP4726Axx, MCP47DA1T, and MCP9510xx device families available in 6L SOT-23 package assembled at MMT assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.
Statut du produit:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=MCP4716A2T-E/CH&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/es/p/semiconductors--analog--data-converters--digital-to-analog-converter/mcp4716a2t-e-ch-microchip-5006232
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=MCP4716A2T-E/CH&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/es/p/semiconductors--analog--data-converters--digital-to-analog-converter/mcp4716a2t-e-ch-microchip-5006232
Microchip MCP4716A2T-E/CH - Caractéristiques techniques
| Interface: | I2C |
| No of Channels: | 1 |
| Resolution: | 10b |
| Supply Voltage: | 2.7V to 5.5V |
| Style d'emballage : | SOT-23-6 (SOT-26) |
| Méthode de montage : | Surface Mount |
Fonctionnalités et applications
The VREF pin or the device VDD can be selected as the DAC’s reference voltage. When VDD is selected, VDD is connected internally to the DAC reference circuit. When the VREF pin is used, the user can select the output buffer’s gain to 1 or 2. When the gain is 2, the VREF pin voltage should be limited to a maximum of VDD/2.
The DAC Register value and configuration bits can be programmed to nonvolatile memory (EEPROM). The
nonvolatile memory holds the DAC Register and configuration bit values when the device is powered off. A device reset (such as a Power On Reset) latches these stored values into the volatile memory.
Features:
- Output Voltage Resolutions
- 10-bit: MCP4716
- 8-bit: MCP4706
- Rail-to-Rail Output
- Fast Settling Time of 6 µs (typical)
- DAC Voltage Reference Options
- Nonvolatile Memory (EEPROM)
- Auto Recall of Saved DAC register setting
- Auto Recall of Saved Device Configuration
- Power-Down Modes
- Disconnects output buffer
- Selection of VOUT pull-down resistors (640 kO, 125 kO, or 1 kO)
- Low Power Consumption
- Normal Operation: 210 µA typ
- Power Down Operation: 60 nA typ
- Single-Supply Operation: 2.7 V to 5.5 V
- I2C™ Interface
- Eight Available Addresses
- Standard (100 kbps), Fast (400 kbps), and
- High-Speed (3.4 Mbps) Modes
- Small 6-lead SOT-23 and DFN (2x2) Packages
- Extended Temperature Range: -40°C to +125°C
Applications:
- Set Point or Offset Trimming
- Sensor Calibration
- Low Power Portable Instrumentation
- PC Peripherals
- Data AcquisitionSystems
- Motor Control
View the MCP4716 family of Digital to Analog Converters
Emballages disponibles
Qté d'emballage(s) :
3000 par Reel
Style d'emballage :
SOT-23-6 (SOT-26)
Méthode de montage :
Surface Mount