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Référence fabricant
PIC16C58B-20/SO
PIC16C Series 3 kB Flash 73 B SRAM SMT 8-Bit Microcontroller - SOIC-18
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :42 par Tube Style d'emballage :SOIC-18 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | |||||||||||
Microchip PIC16C58B-20/SO - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for multiple device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.
Description of Change:Qualification of palladium coated copper (PdCu) bond wire and 3280 die attach epoxy in selected products of the 90K, 120K and 121K wafer technologies available in 18L SOIC package at MTAI assembly site.Pre Change: Gold wire and 8390A die attach epoxyPost Change: PdCu wire and 3280 die attach epoxyReason for Change: To improve manufacturability and qualify PdCu bond wire at MTAI assembly site.
Initial Notice: Qualification of palladium coated copper (PdCu) bond wire and 3280 die attach epoxy in selected products of the 90K, 120K and 121K wafer technologies available in 18L SOIC.Description of Change:Qualification of palladium coated copper (PdCu) bond wire and 3280 die attach epoxy in selected products of the 90K, 120K and 121K wafer technologies available in 18L SOIC package at MTAI assembly site.Pre Change: Gold wire and 8390A die attach epoxyPost Change: PdCu wire and 3280 die attach epoxyReason for Change:To improve manufacturability and qualify PdCu bond wire at MTAI assembly site.
Statut du produit:
Microchip PIC16C58B-20/SO - Caractéristiques techniques
| Family Name: | PIC16C |
| Core Processor: | PIC |
| Program Memory Type: | OTP |
| Flash Size (Bytes): | 3kB |
| RAM Size: | 73B |
| Speed: | 20MHz |
| No of I/O Lines: | 12 |
| Peripherals: | POR/Watchdog |
| Number Of Timers: | 1 |
| Supply Voltage: | 2.5V to 5.5V |
| Operating Temperature: | 0°C to 70°C |
| Watchdog Timers: | 1 |
| Style d'emballage : | SOIC-18 |
| Méthode de montage : | Surface Mount |
