
Manufacturer Part #
MCP3304T-BI/SL
13-Bit Differential Input, Low Power A/D Converter with SPI Serial Interface
Microchip MCP3304T-BI/SL - Product Specification
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Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Description of Change: Qualification of Microchip Technology Gresham – Fab 4 (GRTM) as a new fabrication location for multiple device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.
Part Status:
Microchip MCP3304T-BI/SL - Technical Attributes
Package Style: | SOIC-16 |
Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
2600 per Reel
Package Style:
SOIC-16
Mounting Method:
Surface Mount