Manufacturer Part #
MIC22400YML-TR
MIC22400 Series 4 MHz 4 A Integrated Switch Synchronous Buck Regulator - MLF-20
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:5000 per Reel Package Style:MLF-20 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip MIC22400YML-TR - Product Specification
Shipping Information:
ECCN:
PCN Information:
*** Update for PCN 113339 ***Description of Change: Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change: To improve on-time delivery performance by qualifying UNIG as a new assembly site.Estimated First Ship Date: 30 June 2025 (date code: 2527)Revision History:November 22, 2023: Issued initial notification.October 31, 2024: Re-issued initial notification. Updated the qualification plan to include High Temperature Storage Life (HTSL) test. Updated the affected CPN list to remove the EOL'd CPNs. Updated the estimated qualification completion date and the timetable summary from June 2024 to October 2024.May 30, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on June 30, 2025. Updated affected CPN list based on the updated scope to remove selected 93LCxx, 93AAxx, 93C4xx, MCP6xx, 93C8xx, 93C7xx, 24C0xx, MCP1xx, 93C6xx, 24FCxx, SY88xx, PIC1xx, MIC5xx, SY58xx, SY89xx, 93C5xx, 24LCxx, 24AAxx, 34AAxx, 25LCxx, 25AAxx, SPN1xx and MICRxx device families and to add selected MIC46xx, SM802xx, SM803xx, MIC52xx, MIC53xx, MIC82xx, MIC27xx, MIC26xx, MIC84xx, MIC20xx, MIC94xx, MIC22xx, MIC23xx, MIC28xx, MIC44xx, PIC12xx, PIC16xx, PIC18xx and dsPIC33FJ32MC202 device families.September 18, 2025: Re-issued final notification to update the Qualification Report to include wire bond pull, wire bond shear and solderability test results. Updated affected CPN list to remove EOL'd CPNs.
***UPDATE OF PCN109142***Description of Change: Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change: To improve on-time delivery performance by qualifying UNIG as a new assembly site.Estimated First Ship Date: 30 June 2025 (date code: 2527)
PCN Status:Initial NotificationDescription of Change:Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change:To improve on-time delivery performance by qualifying UNIG as a new assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:October 2024
Revision History:May 29, 2023: Issued initial notification.May 24, 2024: Issued final notification. Attached the Qualification Report. Revised the affected parts list due to updated scope. Provided estimated first ship date to be on June 14, 2024.Description of Change:Qualification of UNIG as a new final test site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying UNIG as a new final test site.
Description of Change:Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Pre and Post Change Summary: see attachedmpacts to Data Sheet:NoneChange Impact:NoneReason for Change:To improve on-time delivery performance by qualifying UNIG as a new assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:June 2024
Microchip has released a new Datasheet for the MIC22400 Data Sheet of devices.Notification Status: FinalDescription of Change:? Updated document layout.? Made minor corrections for grammar.? Updated Electrical Characteristics.? Updated description of Figure 2-26 and Figure 2- 27.? Updated Equation 5-2.? Section 4.0, ?Tracking Circuit? was removed. Content was included in Section 5.11.4, Sequencing and Tracking Examples. Figure 4-1 became Figure 5-7.? Updated Figure 5-7 to reflect Microchip terminology. The SPI standard uses the terminology ?Master? and ?Slave?. The equivalent Microchip terminology used in this document is ?Host? and ?Client? respectively.? Updated Section 6.0 ?Packaging Information?.? Removed TSSOP package (mentioned in: Features, Package Types, Temperature Specifications, Section 3.0 ?Pin Descriptions?, Section 5.13, Thermal Considerations, Section 6.0 ?Packaging Information? and Product Identification System).Impacts to Data Sheet: See above details.Reason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 28 March 2023
Part Status:
Microchip MIC22400YML-TR - Technical Attributes
| Topology: | Buck |
| Input Voltage: | 2.6V to 5.5V |
| Output Current-Max: | 4A |
| Switching Frequency-Max: | 4MHz |
| Package Style: | MLF-20 |
| Mounting Method: | Surface Mount |
Features & Applications
The MIC22400YML TR is a high efficiency 4 A integrated switch synchronous buck (step-down) regulator. The MIC22400 is optimized for highest efficiency and achieves over 90% efficiency while still switching at 1 MHz over a broad load range.
The ultra high speed control loop keeps the output voltage within regulation even under extreme transient load swings commonly found in FPGAs and low voltage ASICs. The output voltage can be adjusted down to 0.7 V to address all low voltage power needs. A full range of sequence options are available with the MIC22400. The RC (Ramp Control™) pin allows the device to be connected to another MIC22400 family of products to keep the output voltages within a certain ΔV on start up.
Features:
- Input voltage range: 2.6 V to 5.5V
- Output voltage adjustable down to 0.7 V
- Output current up to 4 A
- Full sequencing and tracking ability
- Power on reset
- Efficiency > 90% across a broad load range
- Programmable frequency 800 kHz to 4 MHz
- Easy RC compensation
- Ultra fast transient response
- 100% maximum duty cycle
- Fully integrated MOSFET switches
- Micropower shutdown
- Thermal shutdown and current limit protection
- 20-pin 3 mm x 4 mm MLF ®
- 20-pin e-TSSOP
- –40 °C to +125 °C junction temperature range
Applications:
- High power density point of load conversion
- Servers and Routers
- DVD recorders
- Computing peripherals
- Base stations
- FPGAs,DSP and low voltage ASIC power
Available Packaging
Package Qty:
5000 per Reel
Package Style:
MLF-20
Mounting Method:
Surface Mount