Livraison gratuite aux États-Unis continentaux à partir de 50 $ US. Des conditions s'appliquent
Les commandes expédiées à l’extérieur des États-Unis seront en attente pendant que l’entreprise évalue les impacts tarifaires.Veuillez contacter votre vendeur pour obtenir de l’aide.
Référence fabricant
MDO500-12N1
MDO Series 1200 Vrrm 560 A 1.3 Vf High Power Diode Module
|
|
|||||||||||
|
|
|||||||||||
| Nom du fabricant: | Littelfuse - IXYS | ||||||||||
| Emballage standard: |
Product Variant Information section
Emballages disponiblesQté d'emballage(s) :2 par Box Méthode de montage :Chassis Mount |
||||||||||
| Code de date: | |||||||||||
Littelfuse - IXYS MDO500-12N1 - Spécifications du produit
Informations de livraison:
Code HTS:
ECCN:
Informations PCN:
Description of Change:?Littelfuse stops the supply of the mounting screws shipped along with its Y1 bipolar power modules (3 screws + washers per Y1 module).?Our dear valued customers shall procure all required screws and washers on their own after the effective date of change (detailed screws information in annex 1).?The list of the affected Y1 power modules is indicated in annex 2.Reason for Change:?Littelfuse is committed to responsibly conducting its manufacturing and distribution operations to protect our employees, communities, and the environment.?This supply stop will lower the weight of the parcels shipped all around the world thus its impact on the environment.?Many customers using automated assembly equipment don?t even use the screws delivered with the modules.
Subject: Inner box packing Label update for Medium Power modules Littelfuse would like to notify you about implementing inner packing box label change for its Medium Power Modules built in our different assembly locations. To harmonize the marking, we will remove Pb-Free marking which is not relevant to all our products portfolio and will only show up a "RoHS compliant" logo which is appropriate to all our power modules. There is no change to fit, form or function of the existing products as the change refers to packing box labelling only.Implementation date: May 1st, 2023 - already in place at some warehouse locations
SUBJECT: Assembled Device Marking Format Changes and Outer Box/Bag Label Format Changes - Change to the assembled device marking format The change affects the date code and tracking number identification. This change does not affect the form, fit or function of the product. See attached for more details - Change to the box label format: The paper sticker label found on the outer box or bag will see a format change that incorporates the Littelfuse logo along with the IXYS logo. The printed information remains the same (PN, Qty, Lot #, date code, country of origin). The change allows for a improved readability. This change does not affect the form, fit or function of the product. REMARKS: This changes from the original IXYS Corporation marking/labeling format to the new IXYS LLC-USA format is being done to conform to the SAP product management system requirements of our parent company Littelfuse Corporation.
After the successful relocation of our TO-240, Y4 and MCC Y1 product families in 2020, 2021 and 2022, Littelfuse would like to notify you about the transfer of the backend manufacturing of our MCO/MDO Y1 package parts to our inhouse assembly factory in Lipa, Philippines. This new Littelfuse facility combines the very best operational excellence and semiconductor expertise to deliver a highly automated, world class facility designed, to meet IATF16949 & VDA6.3 requirements. Our clear focus being to bring high levels of service to our customers and quality products to support future growth of the power semiconductor business.
After the successful relocation of our TO-240, Y4 and MCC Y1 product families in 2020, 2021 and 2022, Littelfuse would like to notify you about the transfer of the backend manufacturing of our MCO/MDO Y1 package parts to our inhouse assembly factory in Lipa, Philippines. This new Littelfuse facility combines the very best operational excellence and semiconductor expertise to deliver a highly automated, world class facility designed, to meet IATF16949 & VDA6.3 requirements. Our clear focus being to bring high levels of service to our customers and quality products to support future growth of the power semiconductor business.
Statut du produit:
-
https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=MDO500-12N1&field4=Littelfuse - IXYS&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--discretes--diodes--bridge-rectifiers/mdo500-12n1-littelfuse-ixys-9330796
-
https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=MDO500-12N1&field4=Littelfuse - IXYS&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--discretes--diodes--bridge-rectifiers/mdo500-12n1-littelfuse-ixys-9330796
Littelfuse - IXYS MDO500-12N1 - Caractéristiques techniques
| Average Rectified Current-Max: | 560A |
| Reverse Voltage-Max [Vrrm]: | 1200V |
| Peak Current-Max: | 16000A |
| Reverse Current-Max: | 30mA |
| Forward Voltage: | 1.3V |
| Méthode de montage : | Chassis Mount |
Emballages disponibles
Qté d'emballage(s) :
2 par Box
Méthode de montage :
Chassis Mount