En raison des conditions météorologiques extrêmes, le traitement et l'expédition des commandes seront retardés.
Référence fabricant
DN2530N3-G
DN2530 Series 300 V 175 mA N-Channel Depletion-Mode Vertical DMOS FET - TO-92-3
| | |||||||||||
| | |||||||||||
| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :1000 par Bag Style d'emballage :TO-92 Méthode de montage :Through Hole | ||||||||||
| Code de date: | |||||||||||
Microchip DN2530N3-G - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
*** Update for PCN 111842 /Location Change***Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication site for multiple device families of DMOS2.5 (63K, 6K, 6FK, 6GK, 6HK) technology available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated First Ship Date: 08 October 2025 (date code: 2541)Revision History: March 26, 2025: Issued initial notification. September 04, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on October 08, 2025.
Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication site for multiple device families of DMOS2.5 (63K, 6K, 6FK, 6GK, 6HK) technology available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated Qualification Completion Date: July 2025
Statut du produit:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=DN2530N3-G&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--discretes--transistors--mosfets/dn2530n3-g-microchip-4048702
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=DN2530N3-G&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--discretes--transistors--mosfets/dn2530n3-g-microchip-4048702
Microchip DN2530N3-G - Caractéristiques techniques
| Fet Type: | N-Ch |
| Drain-to-Source Voltage [Vdss]: | 300V |
| Drain-Source On Resistance-Max: | 12Ω |
| Rated Power Dissipation: | 0.74|W |
| Style d'emballage : | TO-92 |
| Méthode de montage : | Through Hole |
Emballages disponibles
Qté d'emballage(s) :
1000 par Bag
Style d'emballage :
TO-92
Méthode de montage :
Through Hole